Apply on Employer Site

NXP Semiconductors · 4 months ago

SOC Lead

Austin (Oakhill, Office)

Full-time

Hybrid

Senior Level, Lead/Staff

15+ years exp

NXP Semiconductors is a global leader in secure connectivity solutions for embedded applications, and they are seeking a SOC Lead to oversee product execution for Automotive, Consumer, and Industrial ASIL-B/D SoCs. This role involves leading cross-functional teams, managing project plans, and ensuring compliance with design requirements while collaborating closely with various engineering teams.

AppsAutomotiveEnergy EfficiencyInformation TechnologyManufacturingMobileNewsSemiconductorSoftwareVideo

Responsibilities

Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoC’s

Work with architects and systems engineering to define the part. Generate and analyze data to take right and cost-effective architecture decision

Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part

Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to understand and resolve inter/intra functional handoff and challenges

Oversee definition management and make sure the implementation complies with the requirements

Work closely with downstream team's dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed

Work closely with Test and Product engineering teams to enable productization

Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues

Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects

Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements

Mentor engineers across various functions

This role is primarily about leading cross functional teams

During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors

During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering

Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams

Overall, Chip lead is central design point of contact for all cross functional teams associated with the part

Qualification

SoC design leadershipCross functional team leadershipDesign development experienceExperience in smaller geometriesIn engineeringMS in Electrical Engineering