Qualcomm · 1 week ago
Sr. Staff CPU Physical Design CAD Engineer
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
$199K/yr - $298K/yr
4+ years expQualcomm Technologies, Inc. is a leading company in the semiconductor industry, now incorporating NUVIA to enhance its computing platforms. The role of a Sr. Staff CPU Physical Design CAD Engineer involves developing and supporting high-performance CAD flows for custom CPUs, ensuring industry-leading power, performance, and area.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Develop, integrate and release new features in our high-performance place-and-route CAD flow
Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area
Maintain, support and debug implementation flows, and resolve project-specific issues
Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA
Work with EDA vendors to define roadmap and to resolve tool issues
Leverages advanced knowledge of computer architecture, micro-architecture, logic design, circuits, and/or physical design to develop and verify critical high performance and low power CPU designs
Anticipates, identifies, and solves highly complex problems to ensure design completeness, functionality, power, and performance
Collaborates with cross-functional teams to define requirements, specifications, and trade-offs (e.g., performance, power, cost, functionalities, etc.) in order to accomplish product goals
Evaluates all aspects of the design process from conceptualization to productization (i.e., architecture definition, feasibility, pre-silicon design and verification, and post-silicon validation) that meet customer and industry standards
Writes detailed technical documentation (e.g., feature descriptions, architectural descriptions, verification test plans, and implementation details, etc.) for highly complex CPU designs; reviews documentation of junior engineers
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 5+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
OR PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 4+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
Preferred
Masters degree in Electrical/Electronics Engineering or Computer Science
Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role
High level of proficiency in Tcl as well as Python
Experience with automation
Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV
Experience with advanced technology nodes (5nm or lower)
Solid understanding of digital design, timing analysis and physical verification
Strong user of industry-standard place-and-route tools such as Cadence Innovus
Proven track record of managing and regressing place-and-route flows
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
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