Packaging Engineering Intern - MS/PhD - Santa Clara jobs in United States
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Texas Instruments · 3 months ago

Packaging Engineering Intern - MS/PhD - Santa Clara

position4555 Great America Parkway, Santa Clara, CA, 95054, US
timeInternship
remoteOnsite
seniorityIntern
money$45.75/hr - $57/hr

Texas Instruments is a leading company in semiconductor technology, and they are seeking a Packaging Engineering Intern to assist with the design, development, and analysis of semiconductor packaging technologies. The role involves working in cross-functional teams to develop solutions and advancements in packaging technologies.

ComputerDSPSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products
Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization

Qualification

Semiconductor packaging technologiesMaterial characterizationMechanical characterizationThermal characterizationElectrical characterization

Required

Bachelor's Degree
ECL/GTC Required: Yes

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
dateFounded in 1930
location
Dallas, Texas, USA
people-size10001+ employees
web-link
http://www.ti.com

H1B Sponsorship

Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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