Signoff Static Timing Analysis and Spice CAD Engineer jobs in United States
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Qualcomm · 4 days ago

Signoff Static Timing Analysis and Spice CAD Engineer

Qualcomm Technologies, Inc. is a leading company in the engineering domain, particularly in the development of Snapdragon chips. The role involves improving timing and cell characterization methodologies, validating new features, and collaborating with various teams to provide solutions for design requests.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Improving the Timing and Cell Characterization methodology for diverse Mobile, Compute, AI, IoT Snapdragon chips
Participate in the enablement and validation of new cell characterization methodologies and features, through careful spice correlation and CAD development. Collaborate with AI team on ground-breaking initiatives for compute and turn-around time reduction
Correlation of STA tools with spice, version-to-version validation
Provide solutions to the Snapdragon design teams, analyze their requests, and address their requests through ticket queues
Interfacing with EDA vendors to enable production-ready tool sets that satisfy project’s requirement
Setting up, augmenting, and maintaining a regression of complex STA designs
Participate to the STA and Cell Characterization flows and features enablement for foundry advanced process nodes, at block, subsystem, and top level
Participate to the enablement of new methodologies and features for turn-around time reduction on various subsystems such as Modem, GPU, CPU, DDR, Camera, Video, NSP
Interface and drive EDA vendor Application Engineers on the resolution of Signoff problems faced by the Snapdragon design teams
Participate to the specification of new Signoff CAD solutions addressing the PPA requirements of the design teams
Deep dive on STA or/and spice issues and establish as a go-to domain expert
Participate along with Qualcomm talented AI team to R&D initiatives driving differentiation in terms of compute and turn-around time

Qualification

Signoff TimingSpice simulationSTA featuresPythonTCL

Required

Bachelor's degree in Science, Engineering, or related field
Signoff Timing and spice simulation experience
CAD development skills to define and develop tools and methodologies for accuracy, compute
Collaboration with Snapdragon Physical Design and Timing teams
Improving the Timing and Cell Characterization methodology for diverse Mobile, Compute, AI, IoT Snapdragon chips
Participation in the enablement and validation of new cell characterization methodologies and features
Correlation of STA tools with spice, version-to-version validation
Providing solutions to the Snapdragon design teams
Interfacing with EDA vendors to enable production-ready tool sets
Setting up, augmenting, and maintaining a regression of complex STA designs

Preferred

Bachelor's degree, Masters degree or PhD in Computer Engineering, Electrical Engineering, or related field
Deep knowledge of STA features and Timing concepts
2-6 years of experience in Signoff Timing of SoCs at either top-level or block-level
2-6 years of experience with scripting tools and programming languages: Python and TCL preferred

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package designed to support your success at work, at home, and at play

Company

Qualcomm

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Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

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Cristiano Amon
President and Chief Executive Officer
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Isaac Eteminan
CEO
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Company data provided by crunchbase