Texas Instruments · 2 days ago
Packaging Engineering Intern - MS/PhD - Santa Clara
Santa Clara, CA
Internship
Onsite
Intern
$45.75/hr - $57/hrTexas Instruments is a global semiconductor company that designs and manufactures analog and embedded processing chips. They are seeking a Packaging Engineering Intern to assist in the design, development, and analysis of semiconductor packaging technologies, contributing to advancements in miniaturization, integration, and performance.
ComputerDSPSemiconductor
Responsibilities
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products
Participate in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization
Qualification
Required
Currently pursuing an Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering
Cumulative 3.0/4.0 GPA or higher
Preferred
Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
Demonstrated analytical and problem solving skills
Strong written and verbal communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-06
Company data provided by crunchbase