Lead/Sr. Principal Architect jobs in United States
cer-icon
Apply on Employer Site
company-logo

Infineon Technologies · 3 weeks ago

Lead/Sr. Principal Architect

Infineon Technologies is a global leader in semiconductor solutions, and they are seeking a Lead/Sr. Principal Architect to drive platform and IP architecture. The role involves writing architecture specifications, guiding product architects, and collaborating with various teams to ensure software compatibility and platform enhancements.

Consumer ElectronicsElectronicsEnergy EfficiencyManufacturingSemiconductor
check
Work & Life Balance
check
H1B Sponsor Likelynote
Hiring Manager
Elaine Liao
linkedin

Responsibilities

Reporting to the VP/Fellow, Platform Architecture. This position is responsible for driving Platform and IP Architecture
Write System and IP Architecture Specifications for the MXS40Sv2 and MXS22 platforms
Guide product architects during feasibility,definition, and design phases
Work with IP owners to clearly specify architectural and micro-architectural design parameters
Work with product marketing and product architects to define platform enhancements that support product requirements
Identify and lead continuous improvements in platform development processes
Work with boot, firmware, and software teams to ensure software compatibility and migration plans
Work closely with IP owners to understand design impact of architectural changes
Support product architects in understanding platform capabilities, parametrizable features, configurable options, and platform performance

Qualification

SoC architectureIP architectureSystems engineeringCortex-M processorsReal-time embedded OSTechnical writingCross-functional leadershipPositive approachCollaboration

Required

BSEE, MSEE (preferred)
20+ years of experience leading a platform architecture team used in multiple products in production: SoC architecture, IP architecture, and systems engineering (hardware/software partitioning) for multiple market segments
Strong understanding of Cortex-M M0, M33, and M55 32-bit processors; interfaces/protocols (eg AMBA AXI, AHB, APB, etc); power management interfaces/protocols (eg LPI, PPU, etc); security (eg RoT, TrustZone, PSA L2/L3/L4, protection context, CIA, threat modeling, etc); and performance estimation
Excellent technical writing skills, because much of the job is writing hardware specifications that are forward looking
Proven track record leading cross-functional teams, while driving system, hardware, firmware, and software tradeoffs
Positive approach to challenging assignments
This role involves regular collaboration with colleagues in the US (PST Time Zone) so some flexibility in working hours is expected to ensure adequate team overlap

Preferred

Experience writing machine-readable executable specifications
Hands on experience developing solutions with heterogeneous multi-processors and efficient inter-processor communication in the same package/die
Firm understanding of process isolation (including hardware accelerators)
Hands-on experience with real-time embedded operating systems: especially bare metal assembly/C programming, debug, trace, interrupt service routines, exception handling, cache management, memory management, memory protection, virtual-to-physical address translation, TLB, inter-processor communication, concurrent programming, etc
Strong understanding of Cortex-M M85 and embedded RISC-V processors

Benefits

In addition, all employees will be eligible to participate in an incentive plan.

Company

Infineon Technologies

company-logo
Infineon Technologies offers semiconductor solutions, microcontrollers, LED drivers, sensors and Automotive & Power Management ICs.

H1B Sponsorship

Infineon Technologies has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (8)
2023 (12)
2022 (4)
2021 (11)
2020 (4)

Funding

Current Stage
Public Company
Total Funding
$5.55B
Key Investors
European Commission
2025-02-20Grant· $966.23M
2025-02-07Post Ipo Debt· $779.85M
2025-02-04Post Ipo Debt· $2.07B

Leadership Team

leader-logo
Sven Schneider
Chief Financial Officer and Member of the Executive Board
linkedin
leader-logo
Laurent Rémont
SVP & GM MEMS and Magnetics
linkedin
Company data provided by crunchbase