pSemi, A Murata Company · 2 hours ago
Senior Staff Engineer, NPI Packaging R&D
San Diego, CA
Full-time
Onsite
Senior Level, Lead/Staff
$172K/yr - $224K/yr
12+ years exppSemi Corporation is a Murata company driving semiconductor integration, focusing on enhancing capabilities with high-performance semiconductors. The Senior Staff Engineer will lead the internal prototyping assembly laboratory, overseeing the assembly of R&D prototypes and ensuring adherence to industry standards.
Electrical DistributionManufacturingSemiconductor
Responsibilities
Guide cross-functional teams in making critical packaging mechanical decisions throughout the product development stages
Define and develop manufacturing processes by performing detailed design analysis (tolerance analysis, RMS, FMEA, etc.) and guiding risk assessments
Coordinate preparation of design documentation, BOM, and assembly process flows, ensuring all aspects meet technical specifications and quality standards
Mentor junior engineers and lead technical development efforts across packaging and assembly disciplines
Root cause analysis and resolution of issues during both the development and production phases
Qualification
Required
Bachelor's degree in Engineering (Mechanical, Electrical, Packaging, Materials, or Chemical), Physics, or Chemistry
At least 12 years in electronics packaging, including 5 years of hands-on experience in the assembly of LGA, MCM and SiP-specific assembly processes and packaging-related technologies
Experience working with document management systems, e.g. Agile, the ECO process and Product Life Cycle management
Ability to document the assembly process flow via standard, process descriptions, detailed work instructions, quality specifications based on JEDEC & MIL standards
Proficient with design tools such as AutoCAD, Cadence Allegro, CAM350 or similar
Hands-on experience with Solidworks for basic 3D model generation
Experience setting up and overseeing operation of a semiconductor proto-assembly lab for quick turn customer sampling
In-depth understanding of microelectronic packaging technologies, including flip chip bumping, wafer backend processing, and SMT
Experience leading cross-functional teams in a fast-paced, deadline-driven environment
Ability to assess design feasibility, conduct cost-risk analysis, and mitigate technical risks during NPI product development
Preferred
Experience with the design and packaging of RF products
Familiarity with statistical software or tools for analysis
Experience with Excel macros or automation for process optimization, Jira for task management
Knowledge of the assembly process flow and quality requirements per industry standards
Understanding of PCB fabrication and design processes
Knowledge of semiconductor quality and reliability standards and failure modes
Company
pSemi, A Murata Company
pSemi Corporation is a Murata company driving semiconductor integration.
501-1000 employees
H1B Sponsorship
pSemi, A Murata Company has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (22)
2024 (30)
2023 (28)
2022 (38)
2021 (40)
2020 (36)
Funding
Current Stage
Public CompanyTotal Funding
$92.1MKey Investors
Morgenthaler Ventures
2014-08-22Acquired
2012-08-08IPO
2004-11-02Series Unknown· $17.6M
Leadership Team
Mark L. Burgener, Ph.D.
Co-founder
Keith Bargroff
senior vice president, engineering and technology
Recent News
GlobeNewswire News Room
2025-07-08
Company data provided by crunchbase