Northrop Grumman · 3 months ago
Sr Principal Engineer Microelectronic Process - R10208590
Linthicum Heights, MD
Full-time
Onsite
Senior Level, Lead/Staff
$131K/yr - $197K/yr
8+ years expNorthrop Grumman is a leading aerospace and defense technology company seeking a Senior Principal Microelectronics Engineer to lead advanced packaging and microelectronics assembly initiatives for high-reliability, mission-critical systems. The role involves driving innovation, ensuring compliance with industry standards, and mentoring multidisciplinary teams in the development of semiconductor products.
AerospaceData IntegrationManufacturingRemote SensingSecurity
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Packaging Process Leadership: Own end-to-end packaging flows, including wafer prep, laser dicing, die attach (eutectic and epoxy), pick-and-place, wire bonding, hermetic encapsulation, seam sealing, and tape-and-reel
Mission Assurance: Ensure all packaging processes meet MIL-STD, NASA, JEDEC, and customer specifications for high-reliability applications, including Class K space hardware
Integration & Strategy: Provide a system-level perspective of how packaging processes interact and impact device performance, yield, and long-term reliability. Drive design-for-packaging into product development lifecycles
Technical Authority: Serve as a subject matter expert (SME) in packaging for internal teams, customer reviews, and external audits. Provide technical guidance in supplier evaluations, tool procurements, and process qualifications
Problem Solving & Improvement: Lead root cause investigations on complex yield and reliability challenges. Direct corrective and preventive actions across the packaging value stream
Innovation & Capability Growth: Identify and champion new packaging technologies, equipment, and methodologies to improve manufacturability, throughput, and reliability
Collaboration & Mentorship: Partner with design engineering, reliability, operations, and program management teams. Mentor junior engineers and technicians to grow organizational capability in advanced packaging
Documentation & Compliance: Author and review technical documentation, including process travelers, work instructions, and qualification reports to ensure compliance with customer and regulatory standards
Qualification
Required
Bachelor's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field and 8+ years of experience in microelectronics packaging, or 6+ years with a Master's degree, or 4+ years with a PhD
Hands-on and leadership experience with eutectic die attach, thermosonic wire bonding (Au/Al), hermetic encapsulation/seam sealing, and laser dicing along with the demonstrated ability to analyze packaging yield data, drive process improvements, and lead corrective actions
Strong understanding of high-reliability manufacturing standards (MIL-STD-883, MIL-PRF-38535, NASA/ESA packaging guidelines)
Experience working in a production or manufacturing environment and generating specifications for procurement of new equipment
Develop manufacturing processes, work instructions and production layouts required to fabricate the product
Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process
Respond to design and specification changes by capturing details into the manufacturing process
Analyze yield and scrap rate data to aid in improving processes
Proven ability to lead cross-functional teams, interface with customers, and act as a technical authority
Active or ability to obtain a U.S. DoD Secret clearance
Preferred
Master's or PhD in Mechanical Engineering, Materials Science, or related discipline
12+ years of experience in semiconductor/microelectronics packaging for space, defense, or medical devices
Knowledge of mechanical manufacturing and production processes
Respond to technical production issues associated with the product being fabricated
Analyze processes and equipment for process capabilities and downtime
Familiarity with hermeticity testing (helium fine/gross leak), destructive physical analysis, and long-term reliability qualification
Experience applying SPC, DOE, FMEA, and Lean Six Sigma methodologies in packaging environments
Direct experience with supplier oversight, equipment qualification, and government/customer audits
Recognized as a Subject Matter Expert (SME) in packaging for aerospace/defense programs
Demonstrated leadership in advancing packaging capabilities and mentoring engineering talent
Benefits
Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO) for vacation and/or personal business
Company
Northrop Grumman
Northrop Grumman is an aerospace, defense and security company that provides training and satellite ground network communications software.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$3.7BKey Investors
U.S. Department of DefenseNASA
2025-05-27Post Ipo Debt· $1B
2024-01-29Post Ipo Debt· $2.5B
2023-12-20Grant· $72M
Leadership Team
Kenneth Crews
Corporate Vice President and Chief Financial Officer
Tom Wilson
Corporate Vice President, Enterprise Business Development
Recent News
2026-01-09
2026-01-09
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