Lam Research · 21 hours ago
Structural/ Thermal Modeling Engineer 3
Tualatin, OR
Full-time
Hybrid
Mid LevelLam Research is dedicated to excellence in the design and engineering of etch and deposition products in the semiconductor industry. The role involves developing physics-based models and data-driven methodologies to enhance engineering designs and improve performance in semiconductor manufacturing equipment.
CleanTechManufacturingSemiconductor
Responsibilities
Developing physics-based models for Thermo-Elastic, Structural and CFD applications for components in semiconductor capital equipment industry
Data driven modeling - Juncture of physics-based modeling with data-driven, AI/ML methods: Developing methods for translating tool operational data into improved engineering designs
Utilizing DOE, Optimization, and statistical methods to correlate Simulation data to experimental data
Stochastic optimization tools to bridge between simulation and experiments
Predict, measure and analyze the experimental data of mechanical designs, process specification and software programs for semiconductor manufacturing equipment
Uncertainty Quantification & propagation, sensitivity analysis, statistical inference for model calibration, decision making under uncertainty
Developing and maintaining live multi-physics models
Multi-scale modeling from nano, meso to macro levels
Provide design improvements of in-service tools based upon quantitative field measured failure data and less quantitative quality metrics as measured by Lam Research
Use advanced statistical, probabilistic and forecasting methods to best quantify design and performance of overall system
Provide written reports and oral presentation of results to design teams and management
Work directly with mechanical, electrical, process and software engineers to define design requirements, goals and objectives of design, CIP, testing and simulation plans
Qualification
Required
PhD in Mechanical Engineering or closely related field with strong emphasis in solid mechanics, heat transfer and fluid mechanics or related fields
Strong ability and understanding of AI/ML concepts and hybrid physics-based AI/ML modeling software
Coding ability to supplement commercial software for specific applications as needs arise
Ability to work within a team to own and design concepts and drive design decisions
Ability to lead and conduct design reviews in cross functional and matrixed environments
Strong written and oral communication
Self-starter to start own initiatives and projects for continuous improvement in capabilities and design
This is a graduate eligible role
Preferred
Preferred knowledge of chemistry, semiconductor metrology methods, and employing sensors and hardware designs in a vacuum environment is also a plus
Expertise or working knowledge in several of these areas are desired: Big data, AI/ML algorithms and concepts
Multi-physics modeling
Multi-scale modeling, Feature scale from nano, meso scale to macro scale
Heat transfer in low pressure regimes
HPC, optimization and cloud computing
Numerical methods – Smoothed Particle Hydrodynamics (SPH), MD, BTE, Spectral Element, molecular dynamics, DSMC
Thin film mechanics and characterization
Ceramic materials
Fracture mechanics and Fatigue
Uncertainty qualification, error analysis, statistical methods
Statistical theory, DOE, optimization algorithms
Benefits
Lam offers a variety of work location models based on the needs of each role.
Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex.
‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week.
‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.
At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.
Company
Lam Research
Lam Research supplies wafer fabrication equipment and services to the worldwide semiconductor industry.
Founded in 1980
10001+ employees
H1B Sponsorship
Lam Research has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (239)
2023 (170)
2022 (216)
2021 (242)
2020 (182)
Funding
Current Stage
Public CompanyTotal Funding
unknown1984-05-11IPO
Leadership Team
Tim Archer
President and CEO
Rick Gottscho
Exec VP and CTO
Recent News
2026-01-05
2025-12-30
Company data provided by crunchbase