Staff High-Speed Digital Design Engineer jobs in United States
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Moog Inc. · 3 months ago

Staff High-Speed Digital Design Engineer

Moog Inc. is a performance-driven company that values technical challenges and teamwork. They are seeking a highly experienced Staff High-Speed Digital Design Engineer to lead circuit card assembly design efforts for space applications, ensuring reliability and performance in high-speed digital electronics.

AerospaceIndustrialNational Security
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Act as the technical authority for circuit card design within the group
Architect and design complex high-speed digital electronics for space applications, including multi-layer PCBs (20+ layers) with microvias and blind/buried vias
Design for and validate high-speed interfaces such as Ethernet, SpaceWire, SERDES, and DDR4
Perform parts derating and worst-case analysis to ensure reliability for space environments
Conduct and/or lead signal integrity (SI) and power integrity (PI) analysis; define analysis methodology and tool usage
Provide direction, mentoring, and formal training to the engineering team on SI/PI and high-speed design topics
Create, update, and maintain group design rules, techniques, and engineering best practices (including EMI/EMC mitigation)
Lead root-cause investigations and failure analyses; recommend and implement design improvements
Perform deep technical design reviews of peer work and provide final approval for complex designs
Collaborate with cross-functional teams (hardware, firmware, test, manufacturing) to ensure designs meet performance, manufacturability, and testability requirements

Qualification

Signal integrity analysisPower integrity analysisHigh-speed PCB designWorst-case analysisEMI/EMC design techniquesDesign for Test (DFT)Design for Manufacturability (DFM)Mentoring skillsCommunication skills

Required

Bachelor's degree in Electrical Engineering or a related technical field; Master's degree preferred
Minimum 10 years of engineering experience in avionics, digital electronics, power systems, or embedded development with increasing technical responsibility
Demonstrated deep expertise in signal integrity analysis
Demonstrated deep expertise in power integrity analysis
Demonstrated deep expertise in worst-case analysis and parts derating
Demonstrated deep expertise in high-speed PCB design techniques (multi-layer, microvias, blind/buried vias)
Demonstrated deep expertise in EMI/EMC design techniques and mitigation strategies
Hands-on experience with industry SI/PI tools and PCB design toolflows
Strong written and verbal communication skills; proven ability to mentor and lead engineers

Preferred

Experience supporting space-grade systems
Experience with Design for Test (DFT) and Design for Manufacturability (DFM)
Familiarity with relevant space and military standards and processes

Benefits

Great compensation package
Annual profit sharing
Matching 401k
Ability to participate in Employee Stock Purchase Plan
Flexible Spending and Health Savings Accounts
Flexible paid time off
Holidays and parental leave program
Relocation assistance
Comprehensive insurance coverage including medical, dental, vision, life, disability, Employee Assistance Plan (“EAP”) and other supplemental benefit coverages
Tuition Assistance
Mentorship and coaching opportunities
Leadership development and other personal growth programs
Inclusive culture rooted in our values
Enhanced by Employee Resource Groups
Team-building activities
Additional site-specific benefits may be offered

Company

Moog Inc.

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We work on some of the world’s most exciting technical projects, creating products that challenge the limits of what’s possible, from cutting-edge medical technology to space vehicles.

H1B Sponsorship

Moog Inc. has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (2)
2022 (2)
2021 (2)

Funding

Current Stage
Public Company
Total Funding
$250M
2025-05-30Post Ipo Debt· $250M
1980-06-06IPO

Leadership Team

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Pat Roche
President & Chief Executive Officer
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Emma Tamplin
Group Vice President Human Resources
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Company data provided by crunchbase