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AMD · 1 day ago

IC Packaging Integration Engineer

Austin, TX

Full-time

Onsite

Mid, Senior Level

$118K/yr - $177K/yr

AMD is a company dedicated to building innovative products that enhance computing experiences across various domains. The IC Packaging Integration Engineer will drive advanced IC packaging technology development, ensuring product design integration and supplier engagement for continuous improvement.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor

Growth Opportunities

No H1B

Hiring Manager

Andrea Jenkins

Responsibilities

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design

Drive for supplier engagement on continuous improvement and new capabilities ahead of need

Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders

Drive external manufacturer on issue resolution and issue prevention

Monitor and improve product yield and quality through collaboration with design and manufacturing teams

Plan and execute change management from internal or external parties

Involved in regional supplier management - drive to meet Key Performance Indices

Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio

Prepare & present Executive Summary of projects and supplier’s performance

Coordination of activities within/external team to deliver critical metrics

Overseas travel is required

Qualification

2.5D/3D IC packagingNew Product IntroductionSupplier Manufacturing readinessFlip Chip PackagingSignal IntegrityPower IntegrityExecutive presentationJMPMinitabFailure analysisPackage reliabilityESD standardsJedec standardsAutomotive standardsProject managementConflict managementInterpersonal skillsCommunication skillsLeadership skills

Required

Drive advanced 2.5D/3D IC packaging technology development with external manufacturer/material suppliers

Deliver key performance indices in terms of New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities

Be a team player with a commitment to meeting deadlines

Have a drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment

Excellent cross functional project management skills

Conflict management skills

Strong interpersonal skills with good executive presentation & communication skills

Demonstrate strong leadership to excel in work with minimum supervision

Strong interest to grow in people management ladder

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and integrate packaging needs into product design

Drive for supplier engagement on continuous improvement and new capabilities ahead of need

Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders

Drive external manufacturer on issue resolution and issue prevention

Monitor and improve product yield and quality through collaboration with design and manufacturing teams

Plan and execute change management from internal or external parties

Involved in regional supplier management - drive to meet Key Performance Indices

Coordinate market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio

Prepare & present Executive Summary of projects and supplier's performance

Coordinate activities within/external team to deliver critical metrics

Overseas travel is required

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field

Preferred

Strong knowledge in Flip Chip Packaging

Operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process

Track record of development work leading to volume production in Semiconductor manufacturing

Relevant experience in package SI(Signal Integrity) and PI(Power Integrity)

Good leadership and interpersonal skills

Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)

Preferred: PhD in a relevant engineering discipline