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Advanced Microdevices Pvt. Ltd. (India) · 3 months ago

Packaging Engineer

Austin, TX

Full-time

Hybrid

Mid Level

Advanced Micro Devices, Inc is dedicated to transforming lives through technology and innovation. They are seeking a Packaging Engineer to drive advanced 2.5D/3D IC packaging technology development, ensuring design for manufacturing and managing supplier engagement for new product introductions.

BiopharmaBiotechnologyIndustrialManufacturing

Responsibilities

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design

Drive for supplier engagement on continuous improvement and new capabilities ahead of need

Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders

Drive external manufacturer on issue resolution and issue prevention

Monitor and improve product yield and quality through collaboration with design and manufacturing teams

Plan and execute change management from internal or external parties

Involved in regional supplier management – drive to meet Key Performance Indices

Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio

Prepare & present Executive Summary of projects and supplier’s performance

Coordination of activities within/external team to deliver critical metrics

Overseas travel is required

Qualification

Flip Chip PackagingSemiconductor manufacturingValue EngineeringProject managementExecutive presentationFailure analysisPackage reliabilityJMPMinitabESD standardsJedec standardsAutomotive standardsInterpersonal skillsLeadership skillsCommunication skillsConflict management

Required

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field

Team player with a commitment to meeting deadlines

Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment

Excellent cross functional project management skills

Conflict management skills

Strong interpersonal skills with good executive presentation & communication skills

Demonstrating strong leadership to excel in work with minimum supervision

Strong interest to grow in people management ladder

Preferred

PhD in a relevant engineering discipline

Strong knowledge in Flip Chip Packaging

Operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process

Track record of development work leading to volume production in Semiconductor manufacturing

Good leadership and interpersonal skills

Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)