WIT Recruiting · 6 days ago
Optoelectronics Packaging Design Engineer - Powering Autonomous Vehicles
San Francisco, CA
Full-time
Hybrid
Senior Level
5+ years expWIT Recruiting is seeking a highly skilled Optoelectronics Packaging Design Engineer to take ownership of next-generation IC packaging solutions. This role involves leading the design and delivery of advanced optoelectronic packaging while collaborating with various engineering teams and managing manufacturing integration.
Staffing & Recruiting
Responsibilities
End-to-End Ownership: Lead the design, simulation, and delivery of advanced IC packaging solutions, ensuring they meet performance, reliability, and qualification requirements
Collaborative Design: Partner with electrical, optical, and mechanical engineering teams to architect high-performance assemblies for laser and optoelectronic ASIC devices used in demanding environments
Manufacturing Integration: Work closely with quality and manufacturing teams to transition designs from prototype into mass production, ensuring scalability and repeatability
Testing & Validation: Develop and execute rigorous test plans for package and system-level reliability. Conduct root cause and failure analysis to drive continuous improvement
Yield & Process Improvement: Support yield analysis and corrective actions in silicon processing and microelectronic assembly workflows
Vendor Management: Source, qualify, and manage external suppliers, overseeing DFM reviews, low-volume builds, and procurement of substrates, adhesives, optical components, PCBAs, and related tooling
Qualification
Required
5+ years of experience in semiconductor packaging and process development, or 2+ years with a relevant master's degree
Proficiency with 3D CAD tools (e.g., SolidWorks) and FEA simulation platforms (e.g., ANSYS)
Hands-on expertise with automated high-precision die bonding, wirebonding, and optical alignment systems
Experience with multi-layer ceramic, CMOS image sensor, organic substrates, and BGA packages
Background in wafer-level processing, including thin film deposition, RIE silicon processing, wafer bonding, spin coating, and dicing/testing
Working knowledge of advanced failure analysis techniques: X-ray, SEM, 3D interferometry, microscopy, destructive testing, and cross-sectioning
Preferred
Bachelor's or Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or related field
Experience with optical systems and photonic packaging
Background in ATE environments for package-level testing
Familiarity with statistical process control and high-volume manufacturing analytics
Experience in automated microelectronic or photonic assembly processes, including epoxy/solder die attach, wafer inspection, and underfill dispense
Knowledge of automotive qualification standards such as AEC-Q100
Company
WIT Recruiting
WIT Recruiting provides services for contract staffing, permanent placement, dedicated recruitment (RPO), payrolling, and customized recruiting events.
11-50 employees
Funding
Current Stage
Early StageCompany data provided by crunchbase