Substrate / Advanced Package Engineer (7103) jobs in United States
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TSMC · 3 months ago

Substrate / Advanced Package Engineer (7103)

positionSan Jose, CA
timeFull-time
remoteOnsite
senioritySenior Level, Lead/Staff
money$154K/yr - $250K/yr
date15+ years exp

TSMC is the world’s leading semiconductor foundry, driving innovation in advanced packaging and 3DIC technologies. The Substrate / Advanced Package Engineer will design, simulate, and optimize advanced packaging for 3DIC applications while collaborating with cross-functional teams to define specifications and requirements.

Consumer ElectronicsElectronicsManufacturingProduct DesignSemiconductor
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H1B Sponsorednote

Responsibilities

Design, simulate, and optimize advanced packaging for 3DIC applications
Collaborate with cross-functional teams to define specifications and requirements
Perform modeling of warpage, stress, reliability, and thermal performance using industry-standard EDA tools
Formulate and solve problems in research-driven, often ambiguous domains
Provide guidance on high-speed I/O modeling and integration
Develop and maintain documentation, including specifications, test plans, and design reviews
Stay current with industry trends, tools, and technologies in advanced packaging

Qualification

Advanced packaging technologiesSubstrate designSemiconductor device physicsEDA toolsThermal managementProblem-solving skillsCollaboration skillsMechanical engineering principlesReliability analysisMachine learning techniques

Required

Master's degree or Ph.D. in Electrical Engineering, Mechanical Engineering, or a related field
15+ years of hands-on expertise in advanced packaging technologies and substrate design
Understanding of semiconductor device physics and packaging process technologies
Strong knowledge of warpage, stress, and thermal effects in packaging
Proven ability to drive solutions in ambiguous, research-oriented contexts
Excellent problem-solving, analytical, and communication skills
Strong collaboration skills, with the ability to mentor junior engineers
Ability to balance strategic insight with hands-on technical execution

Preferred

Experience with reliability, IR/EM, and multi-physics analysis
Familiarity with machine learning techniques for design optimization
Patents, publications, or demonstrated innovation in substrate or packaging domains

Benefits

Market competitive pay
Allowances
Bonuses
Comprehensive benefits
Extensive development opportunities and programs

Company

TSMC

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Established in 1987, TSMC is the world's first dedicated semiconductor foundry.
dateFounded in 1987
location
Hsinchu, T'ai-wan, TWN
people-size10001+ employees
web-link
http://www.tsmc.com

H1B Sponsorship

TSMC has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (49)
2024 (27)
2023 (30)
2022 (17)
2021 (31)
2020 (35)

Funding

Current Stage
Public Company
Total Funding
$14.2B
Key Investors
U.S. Department of CommerceBerkshire Hathaway
2024-04-08Grant· $6.6B
2024-01-01Acquired
2022-09-30Post Ipo Equity· $4.1B

Leadership Team

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Morris Chang
Founder, Chairman & CEO
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Peter M. Cleveland
Senior Vice President
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Recent News

Japan Today
Taiwan's TSMC logs net profit jump on AI boom
2026-01-17
RTE Online
TSMC smashes forecasts with record profit, flags more US factories
2026-01-17
Tech
TSMC is set to expand its $165 billion U.S. investment — here’s what we know
2026-01-17
Company data provided by crunchbase