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Northrop Grumman · 3 months ago

Staff Engineer RF Microwave Design - R10209493-2

Annapolis Junction, MD

Full-time

Onsite

Lead/Staff

$163K/yr - $245K/yr

8+ years exp

Northrop Grumman is a leader in designing and delivering microelectronics for military, aerospace, and commercial markets. They are seeking a Staff Engineer RF Microwave Design to support their innovative Microelectronics Design and Applications team, focusing on energy-efficient computing technologies. The role involves designing and verifying RF, microwave, and mixed signal subsystem assemblies while collaborating with various engineering functions.

AerospaceData IntegrationManufacturingRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies

Support verification efforts for RF, Analog, and Digital hardware designs

Collaborating with peer functions such as Mechanical, Manufacturing, Test, and IC design Engineers

Deriving and trading requirements with subsystem engineers and component level designers

Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements

Qualification

RF Microwave DesignElectrical EngineeringHFSSCOMSOLRF/Microwave modeling toolsEM tools for RF packagingSpectrumNetwork analyzerCollaborationProblem-solving

Required

Bachelor Degree in Electrical Engineering or comparable STEM degree and a minimum of 12 years of relevant engineering experience, 10 years of experience with Master's degree, or 8 years of experience with PhD

Working knowledge of HFSS or COMSOL simulation tool

Prior experience working with electronics, mechanical requirements, and schematic drawings

Must be willing to obtain and maintain an active U.S. Top Secret/SCI with Poly Security Clearance

US Citizenship required

Preferred

Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Keysight ADS, Xpedition, Altium)

Well versed in working with EM tools for modeling for RF packaging effects (CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)

Experience with spectrum and network analyzer techniques for EMC measurements

Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)

Experience with Cryogenic test stands, superconductivity and mechanical CTE

Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty