Qualcomm · 2 weeks ago
2.5D Principal Packaging Development Engineer
San Diego, CA
Full-time
Onsite
Senior Level, Lead/Staff
$202K/yr - $302K/yr
6+ years expQualcomm Technologies, Inc. is a leader in foundational technologies that transform how the world connects, computes, and communicates. In this highly visible role, you will be responsible for developing advanced 2.5D packaging technologies and defining baseline assembly processes optimized for performance, reliability, yield, and cost across multiple product application spaces for high performance computing.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Provide leadership and be responsible for developing advanced 2.5D packaging technologies, new product introduction, and high-volume manufacturing
Leverage subject matter expertise in package architecture, high density interconnect, performance, reliability, and cost constraints
Apply hands-on experience in packaging assembly processes, materials, equipment, and design rules
Work with and manage multiple foundries and OSATs to bring up packaging solutions from concept to HVM
Lead cross-functional teams and manage multiple programs
Resolve complex technical issues
Qualification
Required
Bachelor's degree in Mechanical, Electrical or Materials Engineering or related field and 8+ years of experience in advanced packaging technology development, new product introduction and high volume manufacturing
Master's degree in Mechanical, Electrical or Materials Engineering or related field and 7+ years of advanced packaging technology development or related work experience
PhD in Mechanical, Electrical or Materials Engineering or related field and 6+ years of advanced packaging technology development or related work experience
Preferred
M.S. or Ph.D. in Mechanical, Electrical or Materials Engineering or equivalent
15+ years of hands-on experience in packaging technology development in 2.5D/3D for high density D2D interconnects, RDL, fanout bridges, FCBGA, MCM, and related work experience
Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products
Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques
Familiarity with substrate manufacturing processes and design rules
Excellent verbal and written communication skills
Demonstrated organized technical project management skills
Ability to work independently and lead multiple programs
Ability to lead multi-functional teams to solve complex technical problems
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
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