Qualcomm · 20 hours ago
CPU Integration CAD Engineer
Qualcomm Technologies, Inc. is a leader in transforming the industry through innovative silicon and computing platforms. As a CPU Integration CAD Engineer, you will develop and support implementation tools and flows to ensure custom CPUs achieve industry-leading power, performance, and area.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Work closely with worldwide cross-functional teams such as CPU physical design, CPU and SOC Integration, Technology and Central CAD
Develop, integrate, and release flows and methodologies for floorplanning(power planning, pin placement) or PDV analysis(drc/lvs/antenna)
Architect, maintain and support implementation flows, and resolve project-specific issues
Work with EDA vendors to define roadmap and to resolve tool issues
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 4+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 2+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
Ten+ years of hands-on experience in development of high-performance chips - either in a design or CAD role
High level of programming proficiency (Python and Tcl). Knowledge of data structures and algorithms
Experience with automation
Strong user of PNR tool Innovus or PDV Calibre tool or equivalent
Experience with a broad variety of other Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV
Experience with advanced technology nodes (5nm or lower)
Preferred
Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Recent News
2026-01-17
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