BizLink Group · 1 day ago
AI Data Center High-Speed Interconnect Architect
Fremont, CA
Full-time
Onsite
Senior Level, Lead/Staff
10+ years expBizLink Group is seeking an AI Data Center High-Speed Interconnect Architect to define and engineer the architecture for advanced high-speed interconnect systems integral to next-generation AI servers. The role involves collaborating with interdisciplinary teams to develop technologies that meet stringent demands for bandwidth, latency, and reliability in high-density AI and HPC environments.
AutomotiveData CenterElectronicsIndustrialInformation TechnologyManufacturingSolar
Responsibilities
Architectural Design and Optimization: Architect and optimize high-speed interconnect solutions, including backplanes, co-packaged copper, cables, OSFP, OSFP-X, and onboard connectors, for AI/ML and HPC platforms. Achieve equilibrium among performance, signal integrity, power consumption, cost efficiency, and manufacturing feasibility
Technology Assessment: Lead the assessment and selection of interconnect technologies (e.g., NVLINK, UALINK, PCIe, CXL), considering evolving standards and future scalability imperatives
Signal and Power Integrity Management: Collaborate with signal and power integrity engineers to ensure robust high-speed data transmission and adherence to electrical and EMI/EMC standards
Interdepartmental Collaboration: Engage with hardware, system, packaging, and software development teams to integrate interconnect solutions into AI server and rack architectures
Industry Standards Participation: Represent the organization in standards bodies (e.g., OCP, PCI-SIG, UALINK, IEEE, CXL Consortium), influence the formulation of next-generation interconnect standards, and monitor industry trends
Client and Partner Liaison: Interact with hyperscalers, OEMs, and technology partners to ascertain requirements, address challenges, and facilitate the collaborative development of innovative solutions
Technical Documentation and Strategic Planning: Author technical specifications, architecture documents, and contribute to the product roadmap for high-speed interconnects
Qualification
Required
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related discipline
Minimum of 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for compute, networking, or AI platforms
Extensive expertise in high-speed protocols (NVLINK, UALINK, PCIe, CXL, Ethernet, InfiniBand, OSFP, OSFP-X) and advanced connector/cabling technologies
Comprehensive knowledge of signal integrity, power integrity, PCB/package/system design, and relevant simulation tools
Proven experience in participating in or influencing industry standards development
Exceptional communication and cross-functional leadership proficiencies
Preferred
Familiarity with hardware/software co-design and performance analysis for AI/HPC workloads is advantageous
Company
BizLink Group
Founded in 1996 and headquartered in Silicon Valley, USA, BizLink is dedicated to making transformative connections that bring visionary ideas to life.
10001+ employees
H1B Sponsorship
BizLink Group has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3)
2024 (3)
2023 (5)
2022 (4)
2021 (10)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
unknown2011-04-21IPO
Leadership Team
Jean-Marc Vico
Board Vice-President & General Manager (acting as CEO)
Katie Liang
PM - CEO Office
Recent News
2023-12-25
2023-12-25
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