Microchip Technology Inc. · 2 weeks ago
Principal Engineer-Design (Signal and Power Integrity)
Austin, Texas Metropolitan Area
Full-time
Onsite
Lead/Staff
10+ years expMicrochip Technology Inc. is a global organization that specializes in designing technology that powers the world. They are seeking a Principal Engineer-Design specializing in Signal and Power Integrity to develop methodologies for high-speed FPGA products and collaborate with a cross-functional team to provide solutions for customers.
AutomotiveManufacturingSemiconductorWireless
Hiring Manager
Bryant Roe
Responsibilities
Collaborate effectively within a global team environment, demonstrating excellent communication skills (verbal and written)
Possess robust analytical and debugging capabilities for high-speed Signal Integrity and Power Integrity (SIPI) analysis across Die, Package, and Boards
Understand channel loss mechanisms, interpret and optimize eye diagrams, and apply jitter analysis and mitigation techniques
Demonstrate a thorough understanding of correlation methodologies and expertise in crosstalk analysis and reduction
Possess a comprehensive grasp of Power Delivery Network (PDN) design and optimization
Conduct extensive SIPI simulations (pre-layout and post-layout) to optimize signal integrity and power integrity performance at a system level
Influence die changes based on simulation results to ensure optimal SIPI performance
Implement and maintain robust SI/PI strategies throughout the product development lifecycle (die and package)
Proactively identify and address potential SIPI issues early in the design process
Stay abreast of the latest industry trends, emerging tools, and methodologies in SIPI, PDN design, and SerDes transceiver development
Provide technical guidance and mentorship to other SIPI engineers within the team
Develop and refine methodologies for running simulations to ensure robust and reliable PDN systems
Develop strategies and methodologies to guarantee robust performance of high-speed SerDes transceivers, including equalization techniques and advanced jitter analysis
Collaborate effectively with external partners, suppliers, and customers on SI/PI-related topics
Actively contribute to the development of new design methodologies, innovative tools, and streamlined processes to continuously improve SIPI design efficiency and product performance
Qualification
Required
Bachelor of Science (BS) degree in Electrical Engineering or Electronic Engineering is required
10+ years of experience of practical, hands-on experience directly related to Signal Integrity and Power Integrity (SIPI)
Extensive practical experience in Printed Circuit Board (PCB) design and layout principles
Demonstrated experience in resolving SI/PI-related challenges, including Power Delivery Network (PDN) optimization and noise mitigation
Build and construct system level topologies for co-sims on PDN and transceivers
Robust understanding of system-level SIPI design methodologies and analysis techniques (die-level, package-level, board-level)
Proficiency in analyzing and optimizing signal and power integrity across different levels of integration
Thorough understanding of PCB manufacturing processes (design to production)
Strong analytical and problem-solving skills
In-depth understanding of S-Parameter extraction techniques and system-level channel modeling
Expertise in via modeling, connector Time Domain Reflectometry (TDR) analysis, and stack-up analysis
Adept at equalization techniques, jitter analysis, eye diagram analysis, and addressing channel impairments (return loss, insertion loss)
Strong, hands-on experience with industry-standard Field Solvers: Ansys HFSS, Ansys Siwave, Mentor Graphics Hyperlynx, and HSPICE, Redhawk
Experience with simulation tools: Keysight ADS and Mentor Graphics Hyperlynx for pre- and post-layout simulation and analysis
Hands-on experience with Vector Network Analyzers (VNAs), Time Domain Reflectometers (TDRs), Sampling and Real-Time Oscilloscopes, Bit Error Rate Testers (BERTs), de-embedding techniques, and jitter analysis equipment
Preferred
Master of Science (MS) degree in a relevant engineering field is preferable
High-Speed SerDes (Serializer/Deserializer) experience is highly desirable, especially troubleshooting channel-related issues for 32G transceivers and beyond
Experience in performing package analysis and optimization (thermal and mechanical considerations) is a plus
Experience with IBIS-AMI modeling, validation, and correlation is a significant plus
Company
Microchip Technology Inc.
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions.
10001+ employees
H1B Sponsorship
Microchip Technology Inc. has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (170)
2024 (113)
2023 (116)
2022 (119)
2021 (94)
2020 (100)
Funding
Current Stage
Public CompanyTotal Funding
$2.42BKey Investors
Opportunity Now ColoradoSevenBridge Financial GroupSequoia Capital
2025-03-21Post Ipo Equity· $1.32B
2024-05-29Post Ipo Debt· $1.1B
2024-03-19Grant· $1.06M
Leadership Team
Steve Sanghi
CEO and President
Rich Simoncic
Chief Operating Officer
Recent News
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2026-01-09
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2026-01-09
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2026-01-09
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