Principal Application Engineer – Semiconductor Advanced Package jobs in United States
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Veracity Software Inc · 3 months ago

Principal Application Engineer – Semiconductor Advanced Package

Veracity Software Inc is seeking a Principal Application Engineer specializing in Semiconductor Advanced Package. The role involves leading technical support, application development, and troubleshooting for advanced packaging materials in the semiconductor industry, while collaborating with customers and internal teams to ensure product performance and integration.

Information TechnologySaaSSoftwareTechnical SupportWeb Development
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Serve as technical lead for advanced packaging product lines: troubleshoot, optimize, and validate material application processes
Provide deep application knowledge in semiconductor packaging (2.5D, 3D, via, interposer, etc.)
Interface directly with customers to resolve product- or process-related issues, working hands-on to test and develop solutions
Design experiments, run tests, and analyze data for material behavior, reliability, and process compatibility
Ensure new and existing products deliver quantifiable value to customers (yield, throughput, cost)
Solve fundamental technical challenges across product families using Client approaches
Collaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologies
Maintain expertise on industry trends in advanced packaging, materials, and processes
Travel to customer sites or partner locations (up to :10%) as needed

Qualification

Semiconductor advanced packagingMaterial application processesExperimental design2.5D / 3D packagingAnalytical skillsProblem-solving skillsCommunication skillsProject managementTime managementCustomer-oriented mindset

Required

Bachelor's degree in Materials Science / Engineering, Chemical Engineering, Mechanical Engineering, or related field
10+ years experience in semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding)
Strong understanding of 2.5D / 3D packaging, wafer-level encapsulation, molding, underfills, interconnects, etc
Proven track record in taking a product from development through customer implementation
Strong experimental design, analytical, problem-solving, and characterization skills
Excellent verbal and written communication, able to interact with customers and present in group settings
Ability to work independently and cross-functionally in a fast-paced environment
High ownership, customer-oriented mindset, and ability to translate customer needs into technical solutions
Proficiency with project management, time management, and meeting deliverables
Willingness to travel up to 10%

Company

Veracity Software Inc

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The definition of Veracity is accuracy and habitual truthfulness. This truly defines our brand in simplistic terms.

H1B Sponsorship

Veracity Software Inc has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (12)
2024 (13)
2023 (7)
2022 (16)
2021 (23)
2020 (29)

Funding

Current Stage
Growth Stage

Leadership Team

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Chitra Jain
Co-Founder & CEO
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Manohar Suryavanshi
Founder & President
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