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Raytheon · 14 hours ago

Principal Digital Design Engineer - Onsite Tucson, AZ

Tucson, AZ

Full-time

Onsite

Lead/Staff

$101K/yr - $203K/yr

8+ years exp

Raytheon is a leading defense contractor dedicated to helping the nation and allies defend freedoms. They are seeking a Principal Digital Design Engineer responsible for designing, analyzing, simulating, testing, and integrating digital electronic modules for missile applications.

Intellectual PropertyInternetWeb Hosting

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Collaborate, innovate, and team with engineers to generate and utilize today’s cutting-edge technology to design digital electronics circuits that implement missile guidance, video and digital signal processing

Design, analysis, simulation, test, and integration of digital electronic modules and/or CCAs for Missile applications

Experienced in all aspects of circuit card design including hardware designs with processors, FPGAs, memory, and industry interfaces, such as PCIe, Ethernet, I2C, SPI, and UART

Qualification

Digital circuit designPCB design processFPGA developmentMentor Graphics toolsEmbedded test techniquesDesign for productionSignal integrity analysisSoft skills

Required

Bachelor's Degree in Electrical Engineering, Computer Engineering or Electrical Engineering Technology

Minimum of 8 years of engineering digital circuit design experience to include at least 2 of the following: Development and design of electronic circuit designs, multi-assembly system/unit design, Ability to take a design concept from the block diagram or requirements level to development of a complete hardware design, and verification via test and integration, Experience with PCB design process and expertise in tools used to design (schematic capture), analyze and simulate designs prior to hardware execution

The ability to obtain and maintain a US security clearance prior to the start date. U.S. citizenship is required as only U.S. citizen are eligible for a security clearance

Ability to obtain Interim Secret U.S. government issued security clearance is required prior to start date

Preferred

Master's degree in Electrical Engineering

Experience with embedded test techniques, design for test, design margin analysis and design for production for complex circuit card assemblies between 16 and 32 layers

Experience using Mentor Graphics Design Creation (Siemens EDA) tools: DxDesigner, xDX Designer VX, and Xilinx (Zynq Ultrascale, Vivado, Atrix)

Experience using PCB electronic circuit design software: HyperLynx signal integrity, power integrity, and analog simulation, Xpedition Enterprise (xPCB)

Constraint Editor System (CES)

Experience with FPGA code development or software

Experience leading a program transition from development to production

Experience managing technical/schedule risks to identify cost reduction opportunities to meet assigned deadlines

Experience with intellectual property generation (patents & publications)