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Northrop Grumman · 3 months ago

Staff Engineer RF Microwave Design - R10209685

Linthicum Heights, MD

Full-time

Onsite

Lead/Staff

$163K/yr - $245K/yr

8+ years exp

Northrop Grumman is a leader in designing and fabricating microelectronics for military, aerospace, and commercial markets. They are seeking a Staff Engineer RF Microwave Design to support their Microelectronics Design and Applications team in developing energy-efficient computing systems using superconducting technologies.

AerospaceData IntegrationManufacturingRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies

Guide layout of Printed Wiring Boards (PWB) with component placement, interconnect routing and drawing generation

Interface with Electrical and Mechanical engineers to work through mechanical fitment and electrical component placement and routing challenges for rigid, flex assemblies, and rigid-flex assemblies

Interact with suppliers to enable the fabrication of the finished product

Qualification

RF Microwave DesignEM Simulation ToolsPCB DesignEMI/Signal IntegrityCryogenic Test StandsTeam CollaborationProblem SolvingCommunication Skills

Required

Bachelor Degree in Electrical Engineering or comparable STEM degree and a minimum of 12 years of relevant engineering experience (10 years with MS degree; or 8 years with PhD)

Working knowledge of EMI/signal integrity control techniques and EM theory

Working knowledge of EM simulation tools like HFSS or COMSOL

Understand technical theories of electrical and mechanical behavior of PCBs to influence layout decisions

Prior experience working with electronics, mechanical requirements, and schematic drawings

Must be willing to obtain and maintain an active Top Secret/SCI with Poly Security Clearance

US Citizenship required

Preferred

Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Keysight ADS, Xpedition, Altium)

Experience with spectrum and network analyzer techniques for EMC measurements

Prior experience with packaging technologies (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)

Experience with Cryogenic test stands, superconductivity and mechanical CTE

Drafting and design experience in PCB design for fabrication and PWB layer stack up for digital, RF, mixed signal, and power supply CCAs

Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty

Familiarity with semiconductor processes and material