Lucidean · 3 months ago
Senior Module Engineer
Lucidean is pioneering the next generation of optical communications to unlock faster, more efficient AI data centers. As a Senior Module Engineer, you will lead the development of integrated hardware platforms and work closely with various teams to drive technology into final module products.
Network SecuritySemiconductorSoftware
Responsibilities
Define hardware architectures for Lucidean’s next-generation optical transceiver modules
Translate system requirements into optical/electrical/mechanical design specifications
Ensure integrated module is designed for reliability, manufacturing, and cost
Work closely with PIC team to ensure optical engine compatibility with modules
Optimize optical coupling (attach, lensing, tolerances) for performance and manufacturability
Oversee high-speed PCB design, signal integrity, and power integrity for PAM4/coherent lanes
Guide DSP/driver/AFE integration and testing
Thermal modeling, heatsink design, and module reliability strategies for high-power pluggables
Work with test team to establish test plans for module characterization (optical eye, TDECQ, jitter, sensitivity, power consumption)
Lead system-level validation in customer-like environments (switch/router/AI cluster testbeds)
Own early prototypes: hands-on assembly, debugging, and troubleshooting at the bench
Engage with optics, IC, and packaging vendors to qualify components and negotiate specs
Define DFM/DFT strategies, including optical/electrical test, assembly tolerances, and burn-in
Ensure modules comply with MSAs, IEEE/ITU standards, and Telcordia reliability requirements
Support technical discussions with early customers and partners, providing module performance data and roadmap alignment
Qualification
Required
M.S. or Ph.D. in Electrical Engineering, Physics, Optics, or related field
5 years of experience in optical module/hardware development
High-Speed Electronics: Experience with PAM4 and/or coherent links, SerDes, TIAs, drivers, DSPs
Signal Integrity & RF: Eye diagrams, jitter analysis, TDECQ, crosstalk, channel modeling
Packaging & Assembly: Fiber attach, lens alignment, hermetic/non-hermetic packaging, PCB layout, co-packaged optics
Thermal modeling, heatsink design, reliability testing under high power density
Standards Knowledge: IEEE 802.3, OIF, MSAs (QSFP, OSFP, COBO, LPO/CPO)
Test & Characterization: Familiar with BERTs, high-speed oscilloscopes, optical spectrum analyzers, automated test platforms
Simulation/Modeling Tools: Lumerical, Zemax, HFSS, ADS, COMSOL, or equivalent
DFM/DFT, Telcordia GR-468, accelerated lifetime testing, yield optimization
Strong teamwork, collaboration, and communication skills
Preferred
BS required, PHD/MS preferred
5 or more years
Benefits
Competitive salary
Equity options
Comprehensive benefits package
Company
Lucidean
Lucidean develops optical links for AI and data center networks, combining photonics with electronics to increase bandwidth and reduce power
Funding
Current Stage
Early StageTotal Funding
$18.4M2025-12-11Seed· $18.4M
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