Qualcomm · 1 hour ago
Sr. Staff Packaging Engineer
San Diego, CA
Full-time
Onsite
Senior Level, Lead/Staff
$180K/yr - $271K/yr
4+ years expQualcomm Technologies, Inc. is a leading company in foundational technologies that transform how the world connects, computes, and communicates. The Sr. Staff Packaging Engineer will develop advanced 2.5D packaging technologies and define assembly processes optimized for performance and cost across high performance computing applications, while leading cross-functional teams and resolving complex technical issues.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Hand on experience with large body size FCBGA/LGA , FCCSP assembly including die prep, chip attach, underfill, lid/stiffener attach, ball attach, process optimization, material selection, DOE planning, execution, and data analysis
Strong analytical, project management and communication skills working with internal and external cross function teams
Additional experience and knowledge on ABF buildup substrate, EMIB, design and wafer bumping processes is a plus
Work with OSAT, material and equipment suppliers to bring up new process along with driving NPI and HVM deployment
Working with X-functional team to drive packaging structures
Qualification
Required
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience
Extensive knowledge and experience in 2.5D package technology development including architecture definition, assembly processes, thermal-mechanical, materials, and chip-package-interactions
Ability to lead cross-functional teams, manage multiple foundries and OSATs, and resolve complex technical issues
Hand on experience with large body size FCBGA/LGA, FCCSP assembly including die prep, chip attach, underfill, lid/stiffener attach, ball attach, process optimization, material selection, DOE planning, execution, and data analysis
Strong analytical, project management and communication skills working with internal and external cross function teams
Preferred
M.S. in Mechanical, Electrical or Materials Engineering or equivalent
10+ years of hands-on experience in packaging technology development in assembly of IC packages including PoP, SiP, 2/2.5D
Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products
Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques
Familiarity with substrate manufacturing processes and design rules
Excellent verbal and written communication skills
Demonstrated organized technical project management skills
Ability to work independently and lead multiple programs
Ability to lead multi-functional teams to solve complex technical problems
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1752)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
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Business Standard India
2025-12-24
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