Package Engineering Intern - PhD jobs in United States
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Marvell Technology ยท 5 hours ago

Package Engineering Intern - PhD

Marvell Technology is a leader in semiconductor solutions that connect the world through data infrastructure. The Package Engineering Intern will be involved in product-based package projects, engaging in package substrate design and understanding assembly processes to contribute to semiconductor package development.

DSPInternet of ThingsManufacturingSemiconductorWireless
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Learn with product-based package projects from concept through development, prototyping, qualification, and volume production release
Engage in package substrate design and perform package substrate layout review using APD
Understand the basic process of FCBGA assembly and substrate fabrication
Apply engineering knowledge of assembly/substrate fabrication to develop new packages and DFX to improve yield and prevent manufacturing, quality, and reliability issues

Qualification

Semiconductor package designPCB design conceptsAutoCADMechanical EngineeringCommunication skills

Required

Candidate MUST be currently pursuing a Ph. D or MS in Mechanical, Material, or Chemical Engineering
Good verbal and written communication skills
Basic semiconductor package design skills, PCB design concepts, AutoCAD and computer skills

Preferred

Semiconductor package related experience is a plus

Benefits

Medical, dental and vision coverage
Perks and discount programs
Wellness & mental health support including coaching and therapy
Paid holidays
Paid volunteer days
Paid sick time
Additional compensation may be available for intern PhD candidates.

Company

Marvell Technology

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We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.

H1B Sponsorship

Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)

Funding

Current Stage
Public Company
Total Funding
unknown
2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired

Leadership Team

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Matthew Murphy
Chairman and CEO
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Radha Nagarajan
SVP & CTO, Optical Engineering
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Company data provided by crunchbase