Marvell Technology ยท 5 hours ago
Package Engineering Intern - PhD
Marvell Technology is a leader in semiconductor solutions that connect the world through data infrastructure. The Package Engineering Intern will be involved in product-based package projects, engaging in package substrate design and understanding assembly processes to contribute to semiconductor package development.
DSPInternet of ThingsManufacturingSemiconductorWireless
Responsibilities
Learn with product-based package projects from concept through development, prototyping, qualification, and volume production release
Engage in package substrate design and perform package substrate layout review using APD
Understand the basic process of FCBGA assembly and substrate fabrication
Apply engineering knowledge of assembly/substrate fabrication to develop new packages and DFX to improve yield and prevent manufacturing, quality, and reliability issues
Qualification
Required
Candidate MUST be currently pursuing a Ph. D or MS in Mechanical, Material, or Chemical Engineering
Good verbal and written communication skills
Basic semiconductor package design skills, PCB design concepts, AutoCAD and computer skills
Preferred
Semiconductor package related experience is a plus
Benefits
Medical, dental and vision coverage
Perks and discount programs
Wellness & mental health support including coaching and therapy
Paid holidays
Paid volunteer days
Paid sick time
Additional compensation may be available for intern PhD candidates.
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
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