Lead, Thermal Mechanical Engineer (Space Systems) jobs in United States
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L3Harris Technologies · 1 day ago

Lead, Thermal Mechanical Engineer (Space Systems)

L3Harris Technologies is a leader in the defense industry focused on delivering technology solutions for national security. They are seeking a Thermal Mechanical Engineer to lead multidisciplinary teams in thermal design, analysis, and testing of optical systems for space environments.

CommercialInformation TechnologyNational Security
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

System level thermal design & development, payload level integration and test, and risk mitigation for space-based environments
Perform thermal design and analysis tasks on complex mechanical hardware including precision mechanisms, electro-mechanical devices, aerospace mechanism design, complex electronics packaging, supporting space-based deployable mechanisms, avionics, innovative thermal and ground based systems
Create and analyze design concepts using thermal analysis software & FEA
Defines and establishes the technical approach to meet assigned objective
Directs, coordinates and provides assistance to engineering team in order to meet assigned objectives
Program support also includes requirements derivation and verification, system architecture development, loads derivation, trade studies, design sensitivity/optimization studies, preliminary and final design analysis, generation of analysis documentation (including presentation materials, and deliverable data packages), and leading system test activities
Organization of thermal design and analysis as an IPT lead; frequently interfacing directly with customer technical leads and management
Prepares reports, formal documentation and presentation materials summarizing analysis results and present results to both external and internal groups, including leadership and customers
Participates in and present information for Preliminary Design reviews (PDR), Critical Design Reviews (CDR) and Technical Interchange Meetings (TIM)
Interfaces with outside suppliers/customers and other engineering disciplines to drive designs to closure (Structural, Systems Engineering, Electrical, Manufacturing, Performance, Quality, Configuration Management)
Presents design details at program reviews to customers and independent reviewers
Development of thermal test plans to manufacture and test payload sensor systems
Support new business opportunities
Mentor junior level engineers

Qualification

Thermal analysis toolsThermal designTechnical leadershipFinite Element AnalysisThermal vacuum testingMicrosoft OfficeProblem analysisProject engineeringMentoring

Required

Bachelor's Degree in Mechanical Engineering or other related engineering or science degree and minimum 9 years of prior relevant experience
Graduate Degree and a minimum of 7 years of prior related experience
In lieu of a degree, minimum of 13 years of prior related experience
7+ years of professional experience using thermal analysis tools such as Thermal Desktop (preferred), Sinda, Flotherm, Icepak, etc
4+ years of providing technical leadership to a multi-disciplinary mechanical engineering team through system requirements, design, analysis, test, hardware build, delivery and launch
Professional experience with thermal analysis of mechanical and electronic systems, in space, air or ground environments
Professional experience with thermal vacuum testing
Ability to obtain and maintain a U.S. TS/SCI Security Clearance

Preferred

Experience with finite element analysis software
Able to support design decisions with well documented engineering analyses and calculations
Able to analyze problems and to focus and drive down to the root cause of problems quickly
Experience in leading engineering teams from conceptual through detailed design phases
Experience as a lead engineer, project engineer, or IPT lead is a plus
Experience with Microsoft office tools (Word, Excel, PowerPoint, etc.)
Active TS/SCI clearance

Benefits

Health and disability insurance
401(k) match
Flexible spending accounts
EAP
Education assistance
Parental leave
Paid time off
Company-paid holidays

Company

L3Harris Technologies

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L3Harris Technologies provides platform management system solutions for armed forces.

Funding

Current Stage
Public Company
Total Funding
$2.25B
2024-03-27Post Ipo Debt· $2.25B
1978-01-13IPO

Leadership Team

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Tania Hanna
Vice President, Government Relations
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Chip Teets
Senior Director, International Programs, Products & Technology
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Company data provided by crunchbase