Packaging Engineer jobs in United States
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AMD · 3 months ago

Packaging Engineer

Advanced Micro Devices, Inc. (AMD) is dedicated to transforming lives with technology and building products for next-generation computing experiences. The Packaging Engineer role involves driving advanced 2.5D/3D IC packaging technology development, ensuring design for manufacturing, and collaborating with external manufacturers to enhance product quality and yield.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design
Drive for supplier engagement on continuous improvement and new capabilities ahead of need
Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders
Drive external manufacturer on issue resolution and issue prevention
Monitor and improve product yield and quality through collaboration with design and manufacturing teams
Plan and execute change management from internal or external parties
Involved in regional supplier management – drive to meet Key Performance Indices
Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
Prepare & present Executive Summary of projects and supplier’s performance
Coordination of activities within/external team to deliver critical metrics
Overseas travel is required

Qualification

2.5D/3D IC packagingNew Product IntroductionFlip Chip PackagingSemiconductor manufacturingProject managementExecutive presentationValue EngineeringJMPMinitabFailure analysisPackage reliabilityESD standardsJedec standardsAutomotive standardsInterpersonal skillsConflict managementCommunication skillsLeadership skills

Required

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field

Preferred

PhD in a relevant engineering discipline
Strong knowledge in Flip Chip Packaging (while operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage)
Track record of development work leading to volume production in Semiconductor manufacturing
Good leadership and interpersonal skills
Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)

Benefits

AMD benefits at a glance

Company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

H1B Sponsorship

AMD has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (836)
2024 (770)
2023 (551)
2022 (739)
2021 (519)
2020 (547)

Funding

Current Stage
Public Company
Total Funding
unknown
Key Investors
OpenAIDaniel Loeb
2025-10-06Post Ipo Equity
2023-03-02Post Ipo Equity
2021-06-29Post Ipo Equity

Leadership Team

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Lisa Su
Chair & CEO
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Mark Papermaster
CTO and EVP
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Company data provided by crunchbase