Vertiv · 1 week ago
Research Scientist Domain Lead - Thermodynamics
Vertiv is a global critical infrastructure and data center technology company focused on ensuring vital applications run continuously. The Research Scientist Domain Lead - Thermodynamics will lead advanced research initiatives in thermal management technologies, driving innovation and developing solutions for cooling challenges in critical infrastructure.
Data CenterInformation TechnologyIT InfrastructureTelecommunications
Responsibilities
Lead research programs in advanced thermal management and cooling technologies
Drive innovation in next-generation cooling solutions including: Hybrid 1 & 2 phase Direct-to-Chip Cooling, Heat-reuse Architectures, Natural Refrigerants, Cryogenic Cooling systems, Nano-particle fluid additives
Design and validate new cooling paradigms for high-density computing
Develop thermal solutions for AI and high-performance computing applications
Lead experimental programs for new cooling technologies
Collaborate with Power Systems and Materials teams on integrated solutions
Partner with universities and research institutions on thermal innovation
Drive intellectual property development in thermal management
Provide technical guidance on thermal architecture and cooling strategies
Present research outcomes to executive leadership and customers
Qualification
Required
PhD or Master's degree in relevant engineering or scientific discipline
5+ years of experience in Thermodynamics and Cooling research or applied development
Experience with cross-functional collaboration and external engagement
Excellent communication and leadership skills
Travel: 10% travel for research collaboration, conferences, and customer meetings
Physical and Environmental Demands: Laboratory and office environment
Ability to work with various cooling systems and test equipment
May require work in data center environments
Preferred
Strong publication or patent record preferred
Company
Vertiv
Vertiv designs, builds and services critical infrastructure that enables vital applications for data centers and industrial facilities.
Funding
Current Stage
Public CompanyTotal Funding
$1.24BKey Investors
Starboard ValuePlatinum Equity
2022-10-20Post Ipo Equity
2020-02-10Post Ipo Equity· $1.24B
2020-02-10IPO
Recent News
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2026-01-03
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