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Marvell Technology · 1 day ago

Advanced Packaging SI/PI Staff Engineer

Burlington, VT

Full-time

Onsite

Senior Level, Lead/Staff

$107K/yr - $158K/yr

2+ years exp

Marvell Technology is a leader in semiconductor solutions that form the backbone of data infrastructure across various domains. The Advanced Packaging team is seeking a Signal and Power Integrity Engineer to analyze and optimize designs within 2D/2.5D/3D packages, interfacing with product design teams and performing wiring studies for optimal performance.

DSPInternet of ThingsManufacturingSemiconductorWireless

Growth Opportunities

No H1B

U.S. Citizen Only

Hiring Manager

Magda Melena

Responsibilities

SI/PI analysis of designs and optimization within 2D/2.5D/3D packages

Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design

Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination

Qualification

Signal integrityPower integritySimulation toolsCircuit extractionsPCB designSemiconductor packagingCommunication skillsPresentation skillsDocumentation skillsTeam collaboration

Required

Bachelor's degree in electrical engineering or related fields

2+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework and experience in signal integrity and power delivery

Knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies

Understanding of signal integrity and power integrity concepts and fundamentals

Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools

Working knowledge of circuit extractions and simulation techniques

Ability to work with engineers in multiple locations and geographies

Strong communication, presentation and documentation skills

Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design