TAP Engineering ยท 2 months ago
Senior Microelectronics Process Engineer
Fort Meade, MD
Full-time
Onsite
Senior Level, Lead/Staff
15+ years expTAP Engineering is seeking to hire a Senior Microelectronics Process Engineer to join their team. The role involves leading and supporting microelectronics manufacturing projects at various levels of integration, ensuring that contributions are critical and valued in a dynamic environment.
Defense & Space
No H1B
Security Clearance RequiredU.S. Citizen Only
Responsibilities
Lead and support microelectronics manufacturing projects at all levels of integration: die/wafer, component level packaging, multi-chip module (MCM), printed circuit board (PCB), and system level packaging
Qualification
Required
Active TS/SCI w/ full scope polygraph
BS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
15+ Years of overall engineering experience
11+ years of experience working in electronics hardware manufacturing
Experience fabricating, assembling and qualifying 1st article engineering prototypes
Experience with hands-on electronics fabrication (i.e. soldering)
Experience designing, validating and optimizing process leveraged in the fabrication of microelectronics hardware
Experience developing, iterating, troubleshooting, documenting, and communicating manufacturing processes within a production environment
Experience interpreting test and failure analysis results, and providing recommendations or alternatives
Experience researching, evaluating, selecting and recommending electronic materials (i.e. underfill, overmold, die attach, adhesives, thermal interface materials, etc.)
Experience with development, capture and flow-down of technical requirements
Experience developing and executing test plans and procedures
Technical writing, communication, and interpersonal skills
Preferred
MS in Mechanical, Manufacturing, Chemical, Materials Science, or Electrical Engineering (or related technical field)
Familiarity with the following packaging and interconnect technologies/processes: Chip Scale Packaging, BGA Packaging, Multi-Chip Module Packaging, High Density Interconnect, Stacked Die Interconnect, Flip Chip Interconnect, Wirebonding, Redistribution Layers (RDL), Fan-Out-Wafer-Level Packaging (FOWLP), SMT Assembly, Thermal Compression Bonding, Gold Stud Bump Bonding, Low Stand-Off Underfilling, Wafer-to-Wafer and Die-to-Wafer Bonding
Experience programming and operating automated production equipment (i.e. wafer thin/backgrind, wafer dice, die pick and place, wirebond, SMT pick and place, SMT reflow, Xray Inspection, Automated Optical Inspection, etc.)
Company
TAP Engineering
TAP Engineering (LLC) is a small, Maryland-based firm providing secure, trusted microelectronics hardware engineering, firmware development, and research support to the DoD, Intelligence Community, and commercial clients.
11-50 employees
Funding
Current Stage
Early StageCompany data provided by crunchbase