Qualcomm · 2 weeks ago
RF/Analog Design/Mixed-Signal Engineering Internship – Summer 2026
San Diego, CA
Internship
Onsite
Intern
$15.30/hr - $98/hr
Start in 2026 SummerQualcomm Technologies, Inc. is a leader in innovative technology solutions that drive digital transformation. The RF/Analog Design/Mixed-Signal Engineering Internship offers students the opportunity to engage in cutting-edge projects related to RF system design, transceiver performance analysis, and mixed-signal IP architecture.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Push the boundaries of what exists and help establish the new standards for tomorrow
Project opportunities span 5G/6G mmWave, RF system design, transceiver performance analysis and optimization, RFIC/Analog IC design, PA architectures, RF front-end engineering, signal processing/integration, RF microwave design, power amplifiers, WLAN/Bluetooth LNAs, ADC/DAC, and more
Qualification
Required
Currently enrolled in a bachelor's, master's, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
RF, microwave theory, antenna theory
Analog IC design or RFIC design
Electromagnetics, digital pre-distortion, RF matching networks
S-parameters, linear systems, filter design
Digital communication systems, noise figure, linearity (IP3), impedance matching
Memory system design and analysis
High-speed interface system design
Printed circuit board design
Electrical system analysis and modeling
Signal and power integrity (SIPI) analysis
Power delivery network (PDN) design/analysis
Transmission lines, power amplifiers, transmitters, receivers, ACLR
Layout experience and chip tape-out
Programming experience in Perl, MATLAB, Cadence, HFSS
Mixed-signal IP and high-speed interface (ADC/DAC, PLL, sensor, SerDes, DDR) architecture definition, design, implementation, and SoC integration
RTL coding, lint checks, CDC checks, DFT updates, formal equivalency checks, ECO implementation
SERDES (PCIe, USB), memory (DDR, HBM), or 2D/3D die-to-die (D2D) interface system exploration and co-optimization
Static timing analysis and optimization of high-speed critical paths and complex mixed-signal IPs
Cadence design environment
Low-power analog/digital design
Programming experience in Perl, Verilog, Shell, Python, Tcl, SystemVerilog
Preferred
Currently enrolled in a Master's or PhD degree program in computer engineering, computer science, electrical engineering, or a related field
Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Benefits
Competitive hourly pay
Accrued vacation time
Relocation coverage
Furnished housing accommodations
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
Founded in 1985
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
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