Qualcomm · 2 weeks ago
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2026
Chandler, AZ
Internship
Onsite
Intern
$15.30/hr - $98/hr
Start in 2026 SummerQualcomm Technologies, Inc. is a leader in innovative technology solutions. As a Hardware Engineering Intern, you will work on multi-disciplinary teams focusing on areas such as GPU, CPU, and digital design, contributing to the development of next-generation technology.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Engineering design and development in MSM SOC and chipset architecture
ASIC implementation of image processing camera IP
GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
Graphics power analysis & optimization (Vulkan)
Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python
Validation of CPU and SOC-level micro-architecture concepts
Development of test and coverage plans, verification methodology, and scalable environments
Execution of verification plans including regression, debug, and bring-up
Familiarity with simulators, coverage tools, waveform viewers
Programming experience in C, C++, Python
RTL development for modem physical and MAC layer processing
Verification component development using SystemVerilog and UVM
Modeling cellular modem datapaths for bit-exact correctness
Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab
Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
System-level performance modeling and simulation
Power and thermal management strategies
Post-silicon validation and characterization
Embedded software design, driver development for Linux/Windows
OS principles and HW/SW interaction
Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
Understanding of power/performance tradeoffs and system-level architecture
Programming experience in C/C++, Python; scripting and profiling tools
Qualification
Required
Currently enrolled in a bachelor's, master's, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog
Preferred
Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Currently enrolled in a Master's or PhD degree program in computer engineering, electrical engineering, or a related field
Benefits
Relocation coverage
Furnished housing accommodations
Competitive hourly pay
Accrued vacation time
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
Founded in 1985
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
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