Qualcomm · 22 hours ago
Mechanical Engineering Internship – Summer 2026
Austin, TX
Internship
Onsite
Intern
$17/hr - $98/hr
Start in 2026 SummerQualcomm is a leading technology company committed to engineering human progress through intelligent computing. The Mechanical Engineering Internship offers students the opportunity to work on designing, simulating, and testing mechanical and thermal systems that support advanced semiconductor technologies.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems
Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions
Qualification
Required
Currently enrolled in a bachelor's, master's, or Ph.D. degree program in mechanical engineering, materials science, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as Python, Matlab
Preferred
Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Familiarity with Cadence Sip, AutoCAD, and Solidworks
Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
Experience with thermal system design, modeling, and testing
Understanding of heat transfer, mechanical design, and microelectronics
Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation
Benefits
Competitive hourly pay
Accrued vacation time
Relocation coverage
Furnished housing accommodations
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
Founded in 1985
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
Recent News
BiometricUpdate.com
2026-01-12
Company data provided by crunchbase