Teledyne Technologies Incorporated ยท 2 months ago
Senior Principal MMIC Design Engineer
Teledyne Technologies Incorporated is a leader in providing advanced technology solutions across various industrial markets. They are seeking a Senior MMIC Designer to develop cutting-edge GaN and GaAs MMICs for high-power amplifiers and advanced RF/microwave subsystems, while also mentoring junior designers and collaborating with cross-functional teams.
ElectronicsEnergyManufacturingTelecommunications
Responsibilities
Perform detailed design, simulation, layout, and validation of advanced GaN and GaAs MMIC products, with a focus on high-power amplifiers operating at RF, microwave, and millimeter-wave frequencies
Define MMIC specifications based on system-level customer requirements and trade-off analyses
Utilize industry-standard simulation tools (ADS, Cadence AWR, HFSS, Sonnet, AXIEM) for linear, nonlinear, and electromagnetic analysis
Support laboratory validation, including S-parameters, output power, efficiency, load-pull, noise figure, and linearity measurements
Provide technical mentorship and guidance to junior designers and engineering teams
Collaborate with cross-functional teams (program management, mechanical engineering, manufacturing, sales, quality, and leadership) throughout the product development cycle
Assist in proposal efforts, system architecture studies, and internal R&D planning activities
Ensure timely project execution while contributing to continuous process improvements and the advancement of design best practices
Document design activities, development processes, and design reviews in accordance with company and industry standards
Qualification
Required
BSEE with 18+ years or MSEE with 15+ years of experience in RF/MMIC design
Strong theoretical background in RF/microwave distributed-element circuits and transmission lines
Proven track record of successful MMIC product releases to production, preferably for high-frequency and/or high-power applications (X-band, K-band, Ka-band, mmWave preferred)
Expertise in electromagnetic simulation techniques
Familiarity with small-signal and large-signal models of GaAs HEMTs and GaN-on-SiC HEMTs
Experience with PCB and hybrid module design, including MMIC and hybrid circuit integration
Proficient in design techniques such as nonlinear simulation, Cripps Analysis, and stability analysis using loop-gain methods
Strong understanding of load-pull contours and the use of load-pull data to optimize high-power amplifier designs
Expertise in MMIC power amplifier design, including: Nonlinear circuit design and simulation (harmonic balance, load-pull), Impedance matching techniques for high-power, high-PAE amplifiers, Thermal analysis and thermal management strategies, Advanced stability analysis techniques
Deep knowledge of GaAs pHEMT, GaN-on-SiC HEMT, or other advanced compound semiconductor technologies
Experience with advanced RF/microwave packaging technologies
Must be a U.S. Citizen with the ability to obtain and maintain a security clearance
Preferred
Strong technical judgment and engineering decision-making skills, especially in complex or ambiguous situations
Excellent written and verbal communication skills, including technical documentation and presentations
Self-motivated, detail-oriented, and capable of managing multiple projects simultaneously while meeting aggressive schedules
Strong teamwork skills, with the ability to collaborate effectively across cross-functional and customer-facing teams
Company
Teledyne Technologies Incorporated
Teledyne Technologies is a leading provider of sophisticated electronic components, instruments & communications products, including defense electronics, data acquisition & communications equipment for airlines and business aircraft, monitoring and control instruments for industrial and environmental applications and components, and subsystems for wireless and satellite communications.
Funding
Current Stage
Public CompanyTotal Funding
unknown1999-12-03IPO
Leadership Team
Recent News
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