Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal jobs in United States
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Eliyan Corporation · 2 weeks ago

Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

positionBay Area
timeFull-time
remoteOnsite
senioritySenior Level
date5+ years exp

Eliyan is a leading chiplet interconnect startup seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join their advanced packaging team. The role involves developing thermal and electrical simulations for next-generation semiconductor packaging solutions, focusing on high-performance computing and advanced chiplet architectures.

ElectronicsManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawkSC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
Create hierarchical compact macro models (CMM) and reduced-order thermal models for early-stage design optimization
Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
Support customer engagements with technical analysis and present findings to stakeholders

Qualification

Electro-thermal simulationANSYS RedHawk-SCPower integrity analysisThermal managementPythonC/C++TclShell scripting2.5D/3D ICsAnalytical mindsetCommunication skillsCross-functional collaborationSelf-motivatedContinuous learnerResults-oriented

Required

PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTL-to-GDSII flows
Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal co-simulation
Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs
Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
Excellent communication skills to present complex technical concepts to diverse audiences
Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
Self-motivated professional who thrives in fast-paced environments with minimal supervision
Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
Results-oriented engineer delivering high-quality work to enable product milestones on schedule

Preferred

Familiarity with machine learning applications in EDA and design optimization
Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation

Benefits

Excellent benefits

Company

Eliyan Corporation

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Eliyan's mission is to revolutionize chiplet connectivity technologies by challenging the status quo to unleash the ultimate performance of smart systems of the future.
dateFounded in 2021
location
Santa Clara, California, USA
people-size11-50 employees
web-link
https://eliyan.com

H1B Sponsorship

Eliyan Corporation has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (7)
2024 (3)
2023 (3)
2022 (1)

Funding

Current Stage
Growth Stage
Total Funding
$100M
Key Investors
VentureTech AllianceTracker Capital Management
2024-08-13Series Unknown
2024-03-25Series B· $60M
2022-11-08Series A· $40M

Leadership Team

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Syrus Ziai
Founder and VP Engineering
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2025-10-04
Company data provided by crunchbase