SpaceX · 2 hours ago
Dicing Specialist, Silicon Assembly (Starlink)
Bastrop, TX
Full-time
Onsite
Mid, Senior Level
3+ years expSpaceX is actively developing technologies to enable human life on Mars, with a focus on the Starlink satellite constellation to provide reliable internet globally. The Dicing Specialist will operate and program dicing equipment, collaborate with engineers, and ensure the quality and efficiency of silicon wafer processing.
Advanced MaterialsAerospaceManufacturingNational SecuritySpace Travel
No H1B
U.S. Citizen Only
Responsibilities
Operate and program dicing equipment, including diamond saws, laser dicers & groovers, plasma dicers, and stealth dicing systems
Perform full-cut, partial-cut, or scribe-and-break processes on silicon wafers and large-format panels
Develop and refine dicing recipes by adjusting parameters such as blade speed, coolant flow, laser power, and feed rate to achieve clean edges, low die strength loss, and high dice-per-wafer efficiency
Perform in-process and post-dicing inspections using tools like optical microscopes, die shear testers, and particle counters to evaluate edge quality, chipping rates, and contamination levels
Troubleshoot equipment issues, such as blade wear or alignment errors, and conduct preventive maintenance to ensure tool uptime and consistent performance
Collaborate with frontend process teams and packaging engineers to integrate dicing into the overall assembly flow, supporting technology transfers for new wafer sizes (e.g., 300mm) or panel formats (e.g., 600mm)
Document dicing data, generate reports on metrics like throughput, yield loss, and die crack rates, and participate in DOE for process improvements and cost reduction
Maintain cleanroom protocols, including wafer handling best practices, ESD controls, and safety measures for high-speed machinery and laser operations
Support inventory management for consumables like blades and tapes, and assist in qualifying new dicing technologies for high-density interconnects
Qualification
Required
High school diploma or equivalency certificate
3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline
Must be able to work all shifts & be willing to work overtime and/or weekends as needed
Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position
Must be able to lift up to 25lbs. unassisted
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State
Preferred
Bachelor's degree in an engineering, math or science discipline
6+ years of experience in silicon wafer or panel dicing within a semiconductor or microelectronics manufacturing environment
Proficiency with dicing tools and techniques, including mechanical sawing, UV laser dicing, and handling of thinned wafers or glass panels
Strong analytical skills with familiarity in data tools (e.g., Excel, SPC software) for yield tracking and process variability analysis
Ability to work in a shift-based cleanroom, including nights and weekends, with physical capability for precise manual tasks and equipment setup
Commitment to safety standards and quality control in a high-precision, high-volume setting
Experience with advanced dicing for heterogeneous integration, such as chiplets or 3D stacking, or handling ultra-thin wafers
Certification in semiconductor backend processing (e.g., SEMI, IPC) or familiarity with automation in dicing lines
Background in lean manufacturing (LSSGB), root cause analysis (e.g., 8D), or integration with MES systems for real-time monitoring
Company
SpaceX
SpaceX is an aviation and aerospace company that designs, manufactures, and launches rockets and spacecraft.
1001-5000 employees
Funding
Current Stage
Late StageTotal Funding
$11.78BKey Investors
Korea Investment PartnersIntesa SanpaoloAndreessen Horowitz
2025-12-12Secondary Market
2025-09-10Secondary Market
2025-08-13Secondary Market· $10M
Leadership Team
Bret Johnsen
CFO
Charles Kuehmann
VP Materials Engineering
Recent News
2025-12-30
2025-12-30
2025-12-29
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