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SpaceX · 8 hours ago

Die Bonding Specialist, Silicon Assembly (Starlink)

Bastrop, TX

Full-time

Onsite

Mid, Senior Level

3+ years exp

SpaceX was founded with the vision of enabling human life on Mars through advanced technologies. The Die Bonding Specialist for the Starlink project will focus on operating and programming die bonding equipment, developing bonding recipes, and ensuring the quality and reliability of the products delivered for the satellite constellation.

Advanced MaterialsAerospaceManufacturingNational SecuritySpace Travel

Growth Opportunities

No H1B

U.S. Citizen Only

Responsibilities

Operate and program die bonding equipment, including automated pick-and-place systems, epoxy dispensers, flip-chip bonders, and eutectic die attach tools, to achieve accurate die placement with micron-level precision and minimal tilt

Develop and optimize bonding recipes by adjusting parameters such as dispense volume, cure temperature, pressure, and reflow profiles to ensure void-free bonds, strong adhesion, and thermal reliability

Perform in-process inspections using tools like confocal scanning acoustic microscopy (C-SAM), X-ray imaging, and shear testers to evaluate bond quality, alignment accuracy, and defect rates such as delamination or voids

Troubleshoot process variations, equipment downtime, and material incompatibilities through root cause analysis, implementing corrective actions to improve cycle time and first-pass yield

Collaborate with engineers cross-functionally to integrate die bonding into the full packaging flow, supporting qualifications for new die sizes, substrates, or new product introduction (NPI) for advanced packaging formats

Document process data, generate reports on key metrics, participate in design of experiments (DOE) for material and process enhancements/improvements in yield/efficiency & uptime

Maintain cleanroom standards, including ESD protection, adhesive handling protocols, and safety procedures for high-temperature bonding operations

Support inventory control for bonding materials (e.g., epoxies, solders, fluxes) and assist in tool qualifications and preventive maintenance schedules

Qualification

Die bonding techniquesSemiconductor packaging certificationData analysis toolsLean manufacturingFailure analysisManual dexterityCommitment to qualitySafety procedures

Required

High school diploma or equivalency certificate

3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline

Must be able to work all shifts and be willing to work overtime and/or weekends as needed

Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position

Must be able to lift up to 25lbs. unassisted

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State

Preferred

Bachelor's degree in an engineering, math or science discipline

6+ years of hands-on experience in semiconductor die bonding or die attach processes within a packaging or assembly environment

Proficiency with die bonding techniques, including conductive adhesives, solder reflow, and ultrasonic methods, with knowledge of material interactions and thermal management

Familiarity with data analysis and process control tools (e.g., Excel, SPC software) for yield tracking and variability reduction

Ability to work in a shift-based cleanroom, including nights and weekends, with excellent manual dexterity for fine assembly tasks

Strong commitment to quality and safety in a high-volume, precision-driven setting

Experience with advanced die bonding for heterogeneous integration, such as chiplets, fan-out wafer-level packaging (FOWLP), or high-power devices

Certification in semiconductor packaging (e.g., SEMI, IPC standards)

Background in lean manufacturing, failure analysis (e.g., PFMEA), or integration with manufacturing execution systems (MES) for real-time process monitoring