Micron Technology · 2 weeks ago
Intern - Design Architect, HBM
Micron Technology is a world leader in innovating memory and storage solutions. The role involves assisting HBM Architecture Interns in advancing High Bandwidth Memory (HBM) DRAM products using analog and digital circuit expertise.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Collaborate with HBM Build Architects on the composition and development of next-generation HBM DRAM products
Apply analog/digital circuit development expertise in fields like memory arrays, high-speed interfaces, and custom logic
Support multi-functional initiatives involving Build Engineering, Product Engineering, and Process Development
Contribute to architectural decisions impacting high-performance computing and 2.5D/3D packaging
Communicate technical findings and compose insights for internal teams and leadership
Qualification
Required
Actively working towards a graduate degree or similar experience (Master's or PhD or equivalent experience preferred) in Electrical Engineering, Computer Engineering, or a related domain
Experience with CMOS circuit development and understanding of semiconductor device physics
Knowledge of digital (Verilog) and/or analog (FastSpice, HSPICE) modeling and simulation
Strong verbal and written communication skills
Ability to synthesize and convey complex technical concepts effectively
Preferred
Experience in DRAM memory array composition, high-speed clocking/interface invention, or power delivery optimization
Familiarity with 2.5D and 3D packaging technologies
Familiarity with logic and tailored circuit composition methods
Collaborative outlook with a proactive approach to problem-solving
Previous internship or project experience in memory architecture or semiconductor development
Benefits
A choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
A robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Recent News
2026-01-09
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