Persimmons, Inc. · 2 months ago
Senior Package Engineer
San Jose, CA
Full-time
Onsite
Senior Level
7+ years expPersimmons, Inc. is building the infrastructure that will power the next decade of AI. As a Senior Packaging Engineer, you will be responsible for creating and verifying package designs for AI models, managing substrate design, and collaborating with silicon and hardware teams.
Computer Hardware
Responsibilities
Drive end-to-end substrate design from concept through tape-out with minimal oversight; manage OSAT partnerships for cost, schedule and DFM optimization
Design advanced 2.5D/3D interposers for high-speed interfaces (UCIe, HBM, PCIe)
Owner of SI/PI, stack-up definition, PDN architecture & multi-Gbps signal integrity
Execute co-design with silicon & hardware teams: electrical modeling (Ansys Q3D, HFSS), bump pattern optimization, parasitics EMI
Lead DFM reviews with vendors, independently resolve design rule conflicts, deliver manufacturable solutions on schedule
Qualification
Required
BS/MS in Electrical Engineering, Materials Science, or related field
7+ years of hands-on experience in advanced semiconductor packaging design
Strong communication & co-design skills between silicon, package & system
Proven track record w/ advanced substrate & interposer e.g. 2.5D/3D packaging
Experience w/ low-loss PCB materials for high-speed applications
Proficiency in Cadence Allegro Package Designer or similar tools
Familiar with SI/PI tools like Ansys HFSS & SIwave
Experience with DRC, DFM, package reliability testing and failure analysis
Understanding of thermal management solutions for high-power packages
Benefits
Competitive salary and benefits package
Flexible PTO
401k
Company
Persimmons, Inc.
From custom silicon to intelligent algorithms, we’re breaking through the bottlenecks holding AI back, delivering orders-of-magnitude more performance, anywhere it’s needed.
11-50 employees
Funding
Current Stage
Early StageRecent News
2024-11-07
Company data provided by crunchbase