Hewlett Packard Enterprise · 4 months ago
Thermal Design Engineer
Spring, Texas, United States of America
Full-time
Onsite
Mid, Senior Level
$79K/yr - $181K/yr
4+ years expHewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. The Thermal Design Engineer will be responsible for designing and developing thermal solutions for industry standard server platforms, ensuring product functionality and compliance with technical specifications.
Data CenterEnterprise SoftwareInformation TechnologyIT ManagementNetwork Security
Responsibilities
Designs engineering solutions for thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines
Understanding the basic foundations of thermal fluid dynamics and heat transfer
Ability to understand and interpret Computational Fluid Dynamics reports
Understanding of microprocessor architecture and thermal profiles
Understanding of system level thermal design focusing on fan and heatsink technology
Experience effectively dealing with conflict
Ability to effectively communicate product architectures, design proposals and negotiate options at management levels
Ability to establish clear goals and formulate plans to achieve them
Good root-cause analysis and problem-solving skills
Works independently and as part of a team
Excited about technology and has the desire to learn new tasks and technologies
Qualification
Required
Bachelor's or Master's degree in Mechanical Engineering
Typically 4-6 years experience
Designs engineering solutions for thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines
Understanding the basic foundations of thermal fluid dynamics and heat transfer
Ability to understand and interpret Computational Fluid Dynamics reports
Understanding of microprocessor architecture and thermal profiles
Understanding of system level thermal design focusing on fan and heatsink technology
Experience effectively dealing with conflict
Ability to effectively communicate product architectures, design proposals and negotiate options at management levels
Ability to establish clear goals and formulate plans to achieve them
Good root-cause analysis and problem-solving skills
Works independently and as part of a team
Excited about technology and has the desire to learn new tasks and technologies
Using ProEngineer or other 3D CAD software as a mechanical design tool for CFD simulations
Experience with system level thermal and fan control algorithm
Strong analytical and problem solving skills
Strong understanding and experience in electronics packaging
Using CFD and thermal mockups to validate thermal solution
Excellent written and verbal communication skills; mastery in English and local language
Benefits
Health & Wellbeing
Personal & Professional Development
Unconditional Inclusion
Company
Hewlett Packard Enterprise
Hewlett Packard Enterprise is an edge-to-cloud company that uses comprehensive solutions to accelerate business outcomes.
10001+ employees
H1B Sponsorship
Hewlett Packard Enterprise has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (532)
2024 (585)
2023 (591)
2022 (523)
2021 (551)
2020 (398)
Funding
Current Stage
Public CompanyTotal Funding
$2.85BKey Investors
Elliott Management Corp.
2025-04-15Post Ipo Equity· $1.5B
2024-09-10Post Ipo Equity· $1.35B
2015-11-02IPO
Leadership Team
Antonio Neri
President & CEO
Fidelma Russo
EVP & GM, Hybrid Cloud and Chief Technology Officer
Recent News
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