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Northrop Grumman · 2 months ago

Staff Process & Equipment Engineer (AMAT Tools) - R10208008

Linthicum Heights, MD

Full-time

Onsite

Lead/Staff

$163K/yr - $245K/yr

10+ years exp

Northrop Grumman is a leading company in technological advancements and is seeking a Staff Process & Equipment Engineer for their Advanced Technology Lab. The role involves leading engineering efforts utilizing Applied Materials tools to drive process optimization and enhance equipment performance, while collaborating with various engineering functions.

AerospaceData IntegrationManufacturingRemote SensingSecurity

Growth Opportunities

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Lead process and/or equipment engineering efforts utilizing Applied Materials tools, a combination of ENDURA, CENTURA (dry etch and CVD) and MIRRA platforms

Provide informal guidance to process and equipment engineers while collaborating and directing Customer Engineers (CEs) in both conference room and hands-on settings

Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals and process Best Known Methods (BKMs)

Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders such as Operations, Process Engineering, Equipment Engineering, and site director

Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency

Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment malfunctions

Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools

Qualification

Applied Materials tools200mm300mm semiconductor equipmentProcess optimizationExperimental design methodologiesMIRRA CMPCentura CVD platformsAnalytical skillsProblem-solving skillsMentoringTeam collaboration

Required

Bachelor's degree in a STEM discipline (Science, Technology, Engineering, or Math) and 12+ years of related experience; or Master's degree in a STEM discipline and 10 years of related experience

Prior experience with leading OEMs and/or HVM fabs

Proven expertise with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms

Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment

Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement

Able to create and perform equipment and process partitioning to resolve hardware and/or process issues, such as failing mechanical and infilm defects, high film uniformity, failing VPD, and more

Skilled in interpreting and modifying diagrams and schematics to effectively troubleshoot and resolve hardware issues

US citizenship and ability to obtain and maintain a DoD Top Secret/SCI clearance with Poly required

Preferred

Expertise in fingerprinting a wide range of Applied Materials equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables

Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs

Expertise in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput

Expertise in Centura etch eMXP+ systems, specializing in high-aspect-ratio etches on silicon, metal, and dielectrics

Expertise in Centura CVD platforms to deposit high quality SIOx and SiN films, including modifying hardware and/or process

Expertise in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing, expertise in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning