Lead, Embedded Software Engineer (Link 16) jobs in United States
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L3Harris Technologies · 2 months ago

Lead, Embedded Software Engineer (Link 16)

L3Harris Technologies is a leader in the defense industry, committed to delivering cutting-edge technology solutions. The Lead Embedded Software Engineer will design, develop, and test advanced software solutions for tactical radio systems, working closely with engineering teams throughout the software development life cycle.

CommercialInformation TechnologyNational Security
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

The lead embedded software engineer designs, develops and extensively tests complex engineering solutions for future and existing advanced tactical radio operating system and Link 16 waveform software
Engages in hands-on work with lab equipment and new hardware components to support embedded software development
Provides input into new products, processes, standards and/or operational plans that will have measurable impact on the achievement of overall function or business results
Works closely with cross-functional members of the engineering organization to develop and evaluate interfaces between hardware and software, and operational performance requirements and design of the overall system
Participates in all phases of the software development life cycle
Proficient with embedded C/C++, object-oriented design, real-time, multi-threaded programming
Experience developing software for new board and firmware designs
Experience with Linux operating systems
Experience in developing software that interfaces directly with FPGA designs
Knowledge and experience with the Link 16 Waveform
Ability to quickly analyze and understand large and complex existing software systems
Ability to develop software test procedures, software programs, and related documentation
Ability to identify, track, and repair software defects
Ability to work effectively in a multi-disciplinary team environment
Ability to clearly and succinctly convey information and ideas
Implements strategic goals established by leadership
Must be able to obtain a US security clearance

Qualification

Embedded C/C++Linux operating systemsFPGA designsLink 16 WaveformAgile methodologyWireless networking softwareXilinx MicroblazeTeam collaborationCommunication skillsProblem-solving

Required

Proficient with embedded C/C++, object-oriented design, real-time, multi-threaded programming
Experience developing software for new board and firmware designs
Experience with Linux operating systems
Experience in developing software that interfaces directly with FPGA designs
Knowledge and experience with the Link 16 Waveform
Ability to quickly analyze and understand large and complex existing software systems
Ability to develop software test procedures, software programs, and related documentation
Ability to identify, track, and repair software defects
Ability to work effectively in a multi-disciplinary team environment
Ability to clearly and succinctly convey information and ideas
Implements strategic goals established by leadership
Must be able to obtain a US security clearance
Bachelor's Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience
Secret clearance required

Preferred

Experience leading a software development team through a complete development program
Experience with Xilinx Microblaze
Hands on experience with lab equipment and waveform measuring techniques
Experience with the Agile methodology
Experience with wireless networking software system design and development
Familiarity with DSP and RF concepts and technology

Benefits

Health and disability insurance
401(k) match
Flexible spending accounts
EAP
Education assistance
Parental leave
Paid time off
Company-paid holidays

Company

L3Harris Technologies

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L3Harris Technologies provides platform management system solutions for armed forces.

Funding

Current Stage
Public Company
Total Funding
$2.25B
2024-03-27Post Ipo Debt· $2.25B
1978-01-13IPO

Leadership Team

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Tania Hanna
Vice President Government & Customer Relations
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Chip Teets
Senior Director, International Programs, Products & Technology
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Company data provided by crunchbase