Process engineer jobs in United States
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Applied Materials · 2 months ago

Process engineer

Applied Materials is a global leader in materials engineering solutions used to produce advanced chips and displays. They are seeking a highly skilled Process Engineer with experience in photonics and advanced packaging technologies to develop high-performance photonic interconnects and co-packaged optical systems.

ElectronicsManufacturingSemiconductorSoftware
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H1B Sponsor Likelynote

Responsibilities

Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration
Lead Cu backplane RDL design, layout, fabrication, and integration
Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements
Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance
Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance
Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability

Qualification

PhotonicsAdvanced packaging technologiesCu RDL layoutThermal compression bondingCo-Packaged OpticsOptical Engine developmentCleanroom experienceDesign layout softwareCollaborative researchProblem-solving skills

Required

Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered)
Proven experience in Cu RDL layout, design, fabrication, and integration
Hands-on expertise in thermal compression bonding and hybrid bonding processes
Experience with Co-Packaged Optics (CPO) and Optical Engine development
Experience working in cleanroom environments and advanced IC fabrication
Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys
Strong problem-solving skills and ability to work in a collaborative research environment

Benefits

Comprehensive benefits package
Participation in a bonus and a stock award program

Company

Applied Materials

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Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.

H1B Sponsorship

Applied Materials has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)

Funding

Current Stage
Public Company
Total Funding
$2.1B
Key Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M

Leadership Team

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Omkaram Nalamasu
Senior Vice President and Chief Technology Officer
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Tony Chiang, Ph.D
VP, CTO Applied AI
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Company data provided by crunchbase