Texas Instruments · 3 weeks ago
Optical Packaging Engineer
Dallas, TX
Full-time
Onsite
Senior Level
5+ years expTexas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips. The Optical Packaging Engineer will lead the development and implementation of innovative packaging solutions for cutting-edge optical products, collaborating with various teams to ensure product quality and mass production readiness.
ComputerDSPSemiconductor
Responsibilities
Own optical package designs and requirements and maintain quality of existing solutions for a range of optics related products
Define and develop new packaging processes and approaches to meet system specifications including for advanced silicon photonics products
Develop solutions for low-loss, low-cost and scalable fiber-to-chip packaging
Design and develop Heterogenous Integration (HI) assembly processes for photonic and electronic integration
Multiphysics modelling of thermal, mechanical and optical properties and performance
Lead integrity and yield analysis and drive improvement/corrective actions for silicon process and semiconductor assembly packages utilizing appropriate tools
Plan and execute process optimization, characterization, design validation, and failure analysis
Collaborate with external partners to realize packaging solutions and manage vendor relationships
Consider cost effectiveness and perform cost effectiveness studies, develop and introduce package cost reduction programs
Maintain product quality, develop and lead package qualification programs
Ensure mass production readiness by collaborating with engineering and operations teams
Present work and findings to internal and external stakeholders
Qualification
Required
Master's degree or higher in electrical engineering, mechanical engineering, material science or related field
5+ years of relevant experience in semiconductor package/process development, including modeling, test development, device/module qualification
Direct experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips
Experience in semiconductor packaging technology, including die attach, wire bonding, flip-chip, and micro-optics
Strong understanding of device physics, materials, and thermal/mechanical analysis
Optical, mechanical, thermal and electromagnetic modeling and characterization of packages and optical systems
Knowledge of industry optical packaging competitive landscape, trends, industry standards, supply chain, manufacturing equipment and reliability requirements
Demonstrated analytical and problem-solving skills
Preferred
Experience with fiber handling, fiber cleaving, wet processing, fiber connectors
Experience with Optical and electro-optical characterization and probing
Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers
Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics
Strong verbal and written communication skills
Ability to work in teams and collaborate effectively with people in different functions
Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-16
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2026-01-16
2026-01-16
Company data provided by crunchbase