Foxconn Interconnect Technology (FIT) ยท 5 hours ago
Field Application Engineer
Austin, TX
Full-time
Hybrid
New Grad, Entry, Mid Level
0+ years expFoxconn Interconnect Technology, Inc. (FIT) is seeking an experienced Field Applications Engineer to join their sales team. The role involves collaborating with customers and manufacturing engineers to optimize designs, provide technical support, and develop new business opportunities in the interconnect products sector.
ElectronicsLogisticsManufacturing
Hiring Manager
Shilpa Mysore Swamy
Responsibilities
Reviews the 2D drawings and 3D CADs with both customers and back-end manufacturing engineers to identify potential issues and optimization
Work with assigned customer base in designing in FIT interconnect products along with the Account Management and Asia based business units
Reviews and presents DFM reports to customer, including FATP, plastic molding, metal stamping, etc., and converts customers' feedback into actionable items and follow through
Travels to Asia (manufacture sites) or remotely supports the product development, manufacturing, and quality control during the engineering build
Works collaboratively with the sales team to maintain the relationship with customers and to develop new business opportunities by promoting new solutions/technologies
Communicates with customer's technical teams on daily basis to ensure timely technical support
Qualification
Required
College B.S or B.A. degree in Electrical Engineering or Mechanical Engineering
0-4 years of FAE or design engineering experience in a mechanical or electrical engineering role
Self-motivated and able to work with minimal supervision and utilize existing knowledge and sound judgement to thrive in a dynamic environment
Excellent communication and interpersonal skills
Fluent in both English and Chinese (mandarin), oral and written
Able to travel internationally (mostly to Asia) up to 25%
Preferred
Customer interface and/or sales experience within an OEM assignment
Specific technically oriented experience with interconnect products within the Data Center industry
CAD drafting capability: Solid works experience
Experience with Finite Element Analysis
Benefits
Competitive compensation
World class benefits
Incentive and recognition programs
Company
Foxconn Interconnect Technology (FIT)
FIT is an innovative market leader of connectivity technologies within the data center, mobile, computing, and IoT environments.
10001+ employees
H1B Sponsorship
Foxconn Interconnect Technology (FIT) has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (5)
2023 (2)
2022 (9)
2021 (5)
2020 (2)
Funding
Current Stage
Late StageRecent News
IEEE Spectrum
2025-12-29
Business Standard India
2025-10-25
Company data provided by crunchbase