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Teradyne · 1 week ago

PCB Designer / Signal Integrity Engineer (Teradyne, North Reading, MA)

North Reading, MA

Full-time

Onsite

Senior Level, Lead/Staff

$123K/yr - $198K/yr

8+ years exp

Teradyne is a global test and automation specialist powering next-generation technologies through sophisticated solutions. The HW Interface Engineer will lead schematic, layout, and mechanical design reviews for vendor-developed hardware interfaces, ensuring technical consistency and signal integrity across high-impact projects.

Consumer ElectronicsIndustrialIndustrial Automation

No H1B

Hiring Manager

Jennifer (Jen) Leck

Responsibilities

Lead and facilitate schematic, layout, and mechanical design reviews for vendor-developed hardware interfaces

Validate simulation results and ensure signal integrity, mechanical constraints, and manufacturability are addressed

Compare vendor capabilities to guide onboarding, project allocation, and quarterly reviews

Define and maintain technical standards for DIB design, including layout rules, signal routing, and mechanical part usage

Create and manage shared templates and documentation frameworks to ensure consistency across vendors

Mentor field engineers and internal stakeholders on best practices for reviewing vendor designs

Act as the technical reference for high-impact projects requiring elevated scrutiny and rapid turnaround

Contribute to the DIB technology roadmap and innovation initiatives

Qualification

High speed PCB designSignal Integrity expertiseEDA & simulation fluencyIPC CID/CID+ certificationMechanical/thermal integrationMentoring skillsCommunication skills

Required

BSEE or equivalent required; MSEE preferred (EM/high speed a plus)

8–12+ years in high speed PCB/DIB design, SI/PI

IPC CID/CID+ and/or major EDA SI/PI certifications are a plus

Knowledge of Teradyne UltraFLEX test equipment is a plus

High-speed SI/PI expertise for complex DIB/load-boards: stack-ups, loss/crosstalk budgets, return-path control, via strategy, PDN target-Z, decoupling

PCB governance: constraint sets, DFM/DFA/DFT, panelization, coupons, controlled impedance

Mechanical/thermal integration: fixtures, tolerances, stiffness, thermal paths

EDA & simulation fluency: Allegro/OrCAD or Xpedition; Sigrity/HyperLynx; interpret S-parameters, eye/BER, TDR/TDT

Vendor technical governance: capability assessment, allocation, corrective actions, QBR metrics

Mentoring & communication skills; ability to drive standards adoption