NVIDIA · 2 months ago
Chiplet Physical Design Engineer
NVIDIA is a leader in computer graphics and accelerated computing, now pushing the boundaries of AI technology. They are seeking a Chiplet Physical Design Engineer to join their Networking Silicon engineering team, focusing on high-speed communication device development and chip design integration.
AI InfrastructureArtificial Intelligence (AI)Consumer ElectronicsFoundational AIGPUHardwareSoftwareVirtual Reality
Responsibilities
Be part of a cross-business-unit team and own the high-speed IP integration
Build a Chiplet floorplan layout design from early assembly/planning through implementation and signoff
Work closely with partition owners and Full Chip STA engineers to assure high quality and timely convergence
Define and implement efficient, high-quality Chiplet level physical design tools, flows, and methodologies
Gain hands-on experience implementing the partition-level BE design (RTL2GDS)
Qualification
Required
BSEE / MSEE or equivalent experience
8+ years experience in physical design
Experience in unit and top-level floor planning, bump and RDL layout, full-chip clock tree, power grid planning, and DRC/LVS
In depth knowledge of physical design flows and methodologies (PNR, STA, physical verification)
Deep understanding of all aspects of Physical construction and Integration
Knowledge in Physical Design Verification methodology LVS/DRC
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.)
Benefits
Equity
Benefits
Company
NVIDIA
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1877)
2024 (1355)
2023 (976)
2022 (835)
2021 (601)
2020 (529)
Funding
Current Stage
Public CompanyTotal Funding
$4.09BKey Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity
Recent News
2026-01-16
2026-01-16
Company data provided by crunchbase