Hardware Development Engineer, AWS CQC - Fabrication jobs in United States
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Amazon · 2 months ago

Hardware Development Engineer, AWS CQC - Fabrication

Amazon is seeking a Hardware Development Engineer for its AWS Center for Quantum Computing in Pasadena, CA. The role involves developing and improving fabrication and packaging processes for quantum computing product chips, while working in a cleanroom environment and collaborating with project leads.

Artificial Intelligence (AI)DeliveryE-CommerceFoundational AIRetail
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Responsibilities

Developing, improving and sustaining fabrication and packaging processes
Analyzing inline metrology and electrical test data
Interacting with project leads to provide feedback that continuously improves the process

Qualification

Flip chip bondingWire bondingDicingData analysisProgramming skillsCommunication skillsTeamworkProblem solving

Required

Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent, or Bachelor's degree
Expertise in two or more of the following processes and tools: Flip chip bonding tools, wire bonding tools, saw dicing, stealth dicing, electrical probing on wafer/die

Preferred

4+ years of industry or academic research experience
Basic programming skills (e.g. Python, Julia, MATLAB)
Experience conducting sophisticated analysis of complex data and translate the results into actionable deliverables, messages, and presentations
In addition to skills related to packaging process, great to have general working knowledge in one or more of the following device fabrication areas: photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition
Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus

Benefits

Equity
Sign-on payments
Full range of medical, financial, and/or other benefits

Company

Amazon is a tech firm with a focus on e-commerce, cloud computing, digital streaming, and artificial intelligence.

Funding

Current Stage
Public Company
Total Funding
$8.11B
Key Investors
AmazonKleiner Perkins
2023-01-03Post Ipo Debt· $8B
2001-07-24Post Ipo Equity· $100M
1997-05-15IPO

Leadership Team

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Douglas J. Herrington
CEO, Worldwide Amazon Stores
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Werner Vogels
VP & CTO
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