Marvell Technology · 2 days ago
Advanced Package Technology Principal Engineer
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
$148K/yr - $220K/yr
5+ years expMarvell Technology is a leading provider of semiconductor solutions that form the backbone of data infrastructure. The Advanced Package Technology Principal Engineer will own the packaging technology roadmap for AI XPU, lead co-design efforts, and explore innovative technologies to maximize performance while collaborating with cross-functional teams.
DSPInternet of ThingsManufacturingSemiconductorWireless
Hiring Manager
Magda Melena
Responsibilities
Own the packaging technology roadmap for AI XPU, XPU-attach and Switch
Define system-level package architecture including chiplet topology, interposer/substrate scaling, power delivery network strategy, and thermal design envelope
Architect and evaluate packaging technology choices, including silicon/glass interposers, EMIB/bridge, hybrid bonding, fan-out, and 3D stacking
Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability
Work with stakeholders to define and validate advanced design rule roadmap for interposer, substrates and packages
Work with vendors to define and validate equipment, process and material roadmap
Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance
Explore technology feasibility and create proof-of-concept samples
Collaborate with IP, Si design, package design, production and test teams
Lead package material selection, substrate stack-up definition, mechanical modeling, and reliability analysis
Partner with silicon design teams to co-optimize die floorplan, bump map, TSV, and RDL requirements
Support HBM integration strategy (HBM2E / HBM3 / HBM3E) with interposer or bridge-based designs
Work with OSATs / Foundry partners to evaluate process capability, manufacturability, yield, and cost
Perform signal and power integrity trade-off analysis in partnership with SI/PI teams
Drive package qualification and reliability validation to volume readiness
Qualification
Required
Experience in advanced package and substrate technologies with deep understanding of process and materials, component and board level reliability, warpage and thermal management
Experience in managing substrate and assembly material vendors, substrate manufacturers, OSATs and foundries
Bachelor's degree in Mechanical Engineering, Material Science, Electrical Engineering or related fields and 10+ years of related professional experience. OR Master's degree and/or PhD in Electrical Engineering, Mechanical Engineering, Material Science, or related fields with 5+ years of experience
Deep understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
Strong understanding of chip-package interactions and failure mechanism at component and board level, thermal and warpage management
Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe
Ability to influence suppliers to align their roadmap with company goals
Strong communication, presentation and documentation skills
Preferred
Experience setting roadmaps, not just executing them
Demonstrated leadership driving cross-company supplier programs
Prior experience in data center AI accelerators, networking silicon, or custom HPC silicon
Ability to influence senior stakeholders across architecture, silicon design, system platform engineering, and supply chain
Understanding of component (substrate, interposer, etc.) and package designs
Knowledge of signal integrity and power integrity
Board and system level integration
Experience with silicon disaggregation and reaggregation and memory integration
Benefits
Flexible time off
401k
Year-end shutdown
Floating holidays
Paid time off to volunteer
Company
Marvell Technology
We believe that infrastructure powers progress. That execution is as essential as innovation. That better collaboration builds better technology.
5001-10000 employees
H1B Sponsorship
Marvell Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (186)
2023 (154)
2022 (210)
2021 (210)
2020 (165)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-01-20Post Ipo Equity
2016-05-13Post Ipo Equity
2015-02-05Acquired
Leadership Team
Matthew Murphy
Chairman and CEO
Radha Nagarajan
SVP & CTO, Optical Engineering
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