Broadcom ยท 2 days ago
Chip Power Integrity Engineer
Broadcom is a leading technology company, and they are seeking a Chip Power Integrity Engineer. The role involves full-chip power integrity analysis, developing methodologies for large designs, and solving power delivery issues for various products.
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Responsibilities
You are an expert in full-chip power integrity analysis using state of the art tools that are able to parallel process multi-billion node count designs in advanced FinFET process technologies
You have demonstrated solving power integrity problems for a variety of products including 2.5D, spanning from small die with high impedance challenges to massively large chips with large power consumption and significant step load challenges
You have also been involved with helping customers solve voltage budget constraints at the system level through PDN simulations
Developed innovative full-chip power integrity methodologies and flows to handle large node count designs
Developed innovative power integrity methodologies to analyze and sign-off 2.5D and 3D designs
Demonstrated ability to analyze and solve chip power delivery issues/challenges and provide feedback to block owners
Created abstracted macro models for special macros / cells
Performed power delivery network analysis using HSPICE or ADS
In-depth knowledge of Redhawk-SC tool is preferred
Know-how in Totem flow and CMM model creation is nice to have
Familiarity with entire VLSI design flow and tools (Cadence/Synopsys/Mentor) and scripting languages (Tcl, Python)
Qualification
Required
You are an expert in full-chip power integrity analysis using state of the art tools that are able to parallel process multi-billion node count designs in advanced FinFET process technologies
You have demonstrated solving power integrity problems for a variety of products including 2.5D, spanning from small die with high impedance challenges to massively large chips with large power consumption and significant step load challenges
You have also been involved with helping customers solve voltage budget constraints at the system level through PDN simulations
Developed innovative full-chip power integrity methodologies and flows to handle large node count designs
Developed innovative power integrity methodologies to analyze and sign-off 2.5D and 3D designs
Demonstrated ability to analyze and solve chip power delivery issues/challenges and provide feedback to block owners
Created abstracted macro models for special macros / cells
Performed power delivery network analysis using HSPICE or ADS
Education and Experience required: BS in Electrical Engineering and 12+ years related experience or MS in Electrical Engineering and 10+ years related experience
Preferred
In-depth knowledge of Redhawk-SC tool is preferred
Know-how in Totem flow and CMM model creation is nice to have
Familiarity with entire VLSI design flow and tools (Cadence/Synopsys/Mentor) and scripting languages (Tcl, Python)
Benefits
Medical
Dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Paid Family Leave
Other leaves of absence
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Recent News
2026-01-07
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